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会议论文 [30]
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Effect of laser shock processing on the surface morphology and microstructure of metal material
会议论文
Shanghai, China, October 17-20, 2020
作者:
Hu XL(胡宪亮)
;
Zhao JB(赵吉宾)
;
Wu JJ(吴嘉俊)
;
Lu Y(陆莹)
;
Sun BY(孙博宇)
收藏
  |  
浏览/下载:20/0
  |  
提交时间:2021/01/17
laser shock processing
surface morphology
microstructure
aluminum alloy
titanium alloy
superalloy
Damage characteristics of Zr-based metallic glasses under helium ions irradiation
会议论文
Chinese Materials Conference on Special and High Performance Structural Materials, CMC 2015, Guiyang, China, July 10, 2015 - July 14, 2015
作者:
Li FJ
;
Xing JS
;
Zhao ZQ
;
Wei BC(魏炳忱)
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2017/05/05
Damage characteristics
Disordered structures
Irradiation resistance
Partial crystallization
Structural stabilities
Structures and properties
Volume concentration
Zr
based metallic glass
Wettability of Sn-Zn, Sn-Ag-Cu and Sn-Bi-Cu alloys on copper substrates
会议论文
Zhang, Xiaorui
;
Matsuura, Hiroyuki
;
Tsukihashi, Fumitaka
;
Yuan, Zhangfu
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  |  
浏览/下载:4/0
  |  
提交时间:2017/12/03
Properties of Two Lead-free Solder Alloys and Comparison with Sn37Pb
会议论文
International Conference on Advances in Materials and Manufacturing Processes, Shenzhen, PEOPLES R CHINA, 2010-11-06
作者:
Xu, Tianhan
;
Zhao, Maiqun
;
Wang, Danghui
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  |  
浏览/下载:1/0
  |  
提交时间:2019/12/20
Lead-free solder
Microstructure
Properties
Diffusion layer thickness
Fabrication and properties of lead-free Sn-Ag-Cu-Ga solder alloy
会议论文
PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5, 5th Pacific Rim International Conference on Advanced Materials and Processing, Beijing, PEOPLES R CHINA, Web of Science
Chen, GH
;
Ma, JS
;
Geng, ZT
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  |  
浏览/下载:3/0
Comparison of corrosion behavior of soldering alloys and joints
会议论文
7th Fracture Mechanics Symposium (FM 2009), SW Jiaotong Univ, Chengdu, PEOPLES R CHINA, 2009-01-01
作者:
Yang, Fen
;
Wang, Lihua
;
Li, Xiaogang
;
Zhao, Jie
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  |  
浏览/下载:1/0
  |  
提交时间:2019/12/24
Solder
Joint
Corrosion behavior
Lead-free
Corrosion solution
Dissolution amount
Characterization of nanoparticles of lead free solder alloys
会议论文
ESTC 2006 - 1st Electronics Systemintegration Technology Conference, 2006-09-05
作者:
Guan, Wanbing[1]
;
Verma, Suresh Chand[2]
;
Gao, Yulai[3]
;
Andersson, Cristina[4]
;
Zhai, Qijie[5]
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  |  
浏览/下载:1/0
  |  
提交时间:2019/05/10
Characterization of nanoparticles of lead free solder alloys
会议论文
ESTC 2006: 1st Electronics Systemintegration Technology Conference, Vols 1 and 2, Proceedings
作者:
Guan, Wanbing[1]
;
Verma, Suresh Chand[2]
;
Gao, Yulai[3]
;
Andersson, Cristina[4]
;
Zhai, Qijie[5]
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  |  
浏览/下载:1/0
  |  
提交时间:2019/05/10
Rapid manufacturing technology of simple Zn-based alloy plastic mould based on LOM prototype
会议论文
Wuhan, China, October 26, 2004 - October 29, 2004
作者:
Liu, H.
;
Li, Y.
;
Dong, X.
;
Fan, Z.
;
Huang, N.
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  |  
浏览/下载:18/0
  |  
提交时间:2020/11/15
Casting
Cost effectiveness
Factory automation
Quality assurance
Rubber molding
Solidification
Zinc alloys
Fabricating process
Precision casting technology
Rapid manufacturing technology
Silicone rubber moulds
Creep fracture behaviour of joints soldered by a nano-composite solder, lead-free and conventional tin-lead solders (EI收录)
会议论文
11th International Conference on Fracture 2005, ICF11, Turin, Italy, March 20, 2005 - March 25, 2005
作者:
Zhang, X.P.[1,2]
;
Shi, Y.W.[3]
;
Mai, Y.W.[1]
;
Shrestha, S.[4]
;
Dorn, L.[4]
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/04/18
Creep
Creep resistance
Fractography
Fracture
Fracture mechanics
Lead
Microelectronics
Nanocomposites
Particle reinforced composites
Silver
Silver alloys
Soldering alloys
Textures
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