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	Creep fracture behaviour of joints soldered by a nano-composite solder, lead-free and conventional tin-lead solders (EI收录)
	Zhang, X.P.[1,2]; Shi, Y.W.[3]; Mai, Y.W.[1]; Shrestha, S.[4]; Dorn, L.[4]
会议名称	11th International Conference on Fracture 2005, ICF11
会议日期	March 20, 2005 - March 25, 2005
会议地点	Turin, Italy
关键词	Creep Creep resistance Fractography Fracture Fracture mechanics Lead Microelectronics Nanocomposites Particle reinforced composites Silver Silver alloys Soldering alloys Textures
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2117782
专题	华南理工大学
作者单位	1.[1] Centre for Advanced Materials Technology, School of Aerospace, Mechanical and Mechatronic Engineering, University of Sydney, NSW 2006, Australia 2.[2] School of Mechanical Engineering, South China University of Technology, Guangzhou 510641, China 3.[3] School of Materials Science and Engineering, Beijing Polytechnic University, Beijing 100022, China 4.[4] Institute of Materials Surface Engineering and Technology, Technical University Berlin, D-10623, Germany
推荐引用方式 GB/T 7714	Zhang, X.P.[1,2],Shi, Y.W.[3],Mai, Y.W.[1],等. Creep fracture behaviour of joints soldered by a nano-composite solder, lead-free and conventional tin-lead solders (EI收录)[C]. 见:11th International Conference on Fracture 2005, ICF11. Turin, Italy. March 20, 2005 - March 25, 2005.

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