| Properties of Two Lead-free Solder Alloys and Comparison with Sn37Pb | |
| Xu, Tianhan; Zhao, Maiqun; Wang, Danghui | |
| 2011 | |
| 会议名称 | International Conference on Advances in Materials and Manufacturing Processes |
| 会议日期 | 2010-11-06 |
| 会议地点 | Shenzhen, PEOPLES R CHINA |
| 关键词 | Lead-free solder Microstructure Properties Diffusion layer thickness |
| 页码 | 540-+ |
| 会议录 | MATERIALS PROCESSING TECHNOLOGIES, PTS 1 AND 2
 |
| URL标识 | 查看原文 |
| WOS记录号 | WOS:000289011500106 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5025944 |
| 专题 | 西安理工大学 |
| 推荐引用方式 GB/T 7714 | Xu, Tianhan,Zhao, Maiqun,Wang, Danghui. Properties of Two Lead-free Solder Alloys and Comparison with Sn37Pb[C]. 见:International Conference on Advances in Materials and Manufacturing Processes. Shenzhen, PEOPLES R CHINA. 2010-11-06. |
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