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	Wettability of Sn-Zn, Sn-Ag-Cu and Sn-Bi-Cu alloys on copper substrates
	Zhang, Xiaorui ; Matsuura, Hiroyuki ; Tsukihashi, Fumitaka ; Yuan, Zhangfu
	2012
DOI	10.2320/matertrans.M2011349
英文摘要	The wettability of Sn9mass% Zn and Sn3mass% Ag0.5mass% Cu eutectic alloys and the new lead-free alloys Sn-17mass% Bi-0.5mass% Cu and Sn-30mass% Bi-0.5mass% Cu on a Cu substrate has been investigated by the sessile drop method in Ar atmosphere as a function of time and temperature. The wetting time for Sn-Bi-Cu alloys is much longer than that for Sn-3mass% Ag-0.5mass% Cu eutectic alloy at their liquidus or eutectic temperature. However, the Sn-9mass% Zn alloy has poor wettability on a Cu substrate since Zn may be oxidized to ZnO, resulting in ZnO covering the surface of the droplet. The contact angles of the ternary alloys on a Cu substrate do not decrease monotonically with increasing temperature but do change with time. The wettability on a Cu substrate increases in the order Sn-9mass% Zn, Sn-3mass% Ag-0.5mass% Cu, Sn-17mass% Bi-0.5mass% Cu, Sn-30mass% Bi-0.5mass% Cu, as indicated by their contact angles of 115.8, 49.6, 37.6 and 27.1??, respectively, at 523 K. The addition of Bi clearly greatly improves the wettability of the alloys. ? 2012 The Japan Institute of Metals.; EI; 5; 926-931; 53
语种	英语
内容类型	会议论文
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/461430]
专题	工学院
推荐引用方式 GB/T 7714	Zhang, Xiaorui,Matsuura, Hiroyuki,Tsukihashi, Fumitaka,et al. Wettability of Sn-Zn, Sn-Ag-Cu and Sn-Bi-Cu alloys on copper substrates[C]. 见:.

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