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	Fabrication and properties of lead-free Sn-Ag-Cu-Ga solder alloy
	Chen, GH ; Ma, JS ; Geng, ZT
	2010-05-10 ; 2010-05-10
会议名称	PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5 ; 5th Pacific Rim International Conference on Advanced Materials and Processing ; Beijing, PEOPLES R CHINA ; Web of Science
关键词	lead-free solder Sn-Ag-Cu-Ga melting point hardness shear strength wetting angle spread ratio JOINTS Materials Science, Multidisciplinary
中文摘要	Sn-Pb solder alloys, widely used in electronic industry, will be restricted because of the toxicity of Pb. That is paramount importance that developing viable alternative lead-free solders for electronic assemblies. Sn-Ag-Cu alloys are better alternative because of its good performance. But they have a melting temperature of 217-225 degrees C that is much higher than that of Sn-Pb eutectic alloy, 183 degrees C. It may be very difficulty to realize industrialization. Sn-Ag-Cu-Ga solder alloys have been studied in this paper, including a series of properties tests, such as melting point, hardness, shear strength and solderability. The best composition of Sn-Ag-Cu-Ga lead-free solder alloy has been obtained.
会议录出版者	TRANS TECH PUBLICATIONS LTD ; ZURICH-UETIKON ; BRANDRAIN 6, CH-8707 ZURICH-UETIKON, SWITZERLAND
语种	英语 ; 英语
内容类型	会议论文
源URL	[http://hdl.handle.net/123456789/18393]
专题	清华大学
推荐引用方式 GB/T 7714	Chen, GH,Ma, JS,Geng, ZT. Fabrication and properties of lead-free Sn-Ag-Cu-Ga solder alloy[C]. 见:PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5, 5th Pacific Rim International Conference on Advanced Materials and Processing, Beijing, PEOPLES R CHINA, Web of Science.

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