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	Characterization of nanoparticles of lead free solder alloys
	Guan, Wanbing[1]; Verma, Suresh Chand[2]; Gao, Yulai[3]; Andersson, Cristina[4]; Zhai, Qijie[5]; Liu, Johan[6]
	2007
会议名称	ESTC 2006 - 1st Electronics Systemintegration Technology Conference
会议日期	2006-09-05
页码	7-12
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2384816
专题	上海大学
作者单位	[1]School of Materials Science and Engineering, Shanghai University, Box 275, Yanchang Road 149, Shanghai 200072, China [2]Sino-Swedish Microsystems Integration Technology Center, Department of Microtechnology and Nanoscience, Chalmers University of Technology, SE - 412 96 G?teborg, Sweden [3]School of Materials Science and Engineering, Shanghai University, Box 275, Yanchang Road 149, Shanghai 200072, China [4]Sino-Swedish Microsystems Integration Technology Center, Department of Microtechnology and Nanoscience, Chalmers University of Technology, SE - 412 96 G?teborg, Sweden [5]School of Materials Science and Engineering, Shanghai University, Box 275, Yanchang Road 149, Shanghai 200072, China [6]Sino-Swedish Microsystems Integration Technology Center, Department of Microtechnology and Nanoscience, Chalmers University of Technology, SE - 412 96 G?teborg, Sweden |Key State Lab. for New Display and System Applications, SMIT Center, Shanghai University, Yanchang Road 149, Shanghai 200072, China
推荐引用方式 GB/T 7714	Guan, Wanbing[1],Verma, Suresh Chand[2],Gao, Yulai[3],et al. Characterization of nanoparticles of lead free solder alloys[C]. 见:ESTC 2006 - 1st Electronics Systemintegration Technology Conference. 2006-09-05.

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