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CORC

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Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文
Microelectronics Reliability, 2022, 卷号: 135
作者:  Yu, Weiyuan;  Li, Binbin;  Wu, Baolei;  Wang, Fengfeng;  Wang, Mingkang
收藏  |  浏览/下载：16/0  |  提交时间：2022/08/09
Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints 期刊论文
MATERIALS CHARACTERIZATION, 2021, 卷号: 178, 页码: 8
作者:  Gao, Li-Yin;  Luo, Yi-Xiu;  Wan, Peng;  Liu, Zhi-Quan
收藏  |  浏览/下载：228/0  |  提交时间：2021/10/15
Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn–58Bi/Ni(P)/Cu solder joints 期刊论文
Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 14, 页码: 11470-11481
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Zhang, Zhe;  Li, Qinglin
收藏  |  浏览/下载：5/0  |  提交时间：2020/11/14
Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文
Journal of Electronic Materials, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602
作者:  Yu, Weiyuan;  Liu, Yingzong;  Liu, Yun
收藏  |  浏览/下载：5/0  |  提交时间：2022/02/17
Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602
作者:  Yu, Weiyuan;  Liu, Yingzong;  Liu, Yun
收藏  |  浏览/下载：2/0  |  提交时间：2019/11/15
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：26/0  |  提交时间：2021/02/02
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：42/0  |  提交时间：2021/02/02
Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi2(Te,Se)3 thermoelectric material 期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 15, 页码: 14791-14804
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin
收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14
Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi-2(Te,Se)(3) thermoelectric material 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 15, 页码: 14791-14804
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin
收藏  |  浏览/下载：7/0  |  提交时间：2019/11/15
Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379
作者:  Shi, QY;  Liu, ZQ;  Wu, D;  Zhang, H;  Ni, DR
收藏  |  浏览/下载：30/0  |  提交时间：2018/06/05

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