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Bioinformatics analysis and function prediction of NBS-LRR gene family in Broussonetia papyrifera
期刊论文
BIOTECHNOLOGY LETTERS, 2023, 卷号: 45, 期号: 1, 页码: 13-31
作者:
Zhang, Xiaokang
;
Wang, Fengfeng
;
Yang, Nianhui
;
Chen, Naizhi
;
Hu, Yanmin
收藏
  |  
浏览/下载:0/0
  |  
提交时间:2024/03/07
Broussonetia papyrifera
NBS-LRR genes
Cis-acting elements
Abiotic stress
DEGs
Preparation of efficient adsorbent with dual adsorption function based on semicoke: adsorption properties and mechanisms
期刊论文
Journal of Colloid And Interface Science, 2022, 卷号: 626, 期号: 0, 页码: 674-686
作者:
Feng Zhao
;
Yuan Zhang
;
Xiaoying Zhang
;
Long Zhao
;
Fengfeng Fu
收藏
  |  
浏览/下载:12/0
  |  
提交时间:2022/12/09
Study of the dynamic wetting behavior of Sn droplet impacting Cu substrate
期刊论文
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2022, 卷号: 128, 期号: 8
作者:
Yu, Weiyuan
;
Wang, Mingkang
;
Wang, Fengfeng
;
Wang, Xiwushan
;
Wu, Baolei
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2022/07/19
Droplet impaction
Droplet solidification
Dynamic wetting behavior
Thermal spraying
Jet formation
Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP
期刊论文
Microelectronics Reliability, 2022, 卷号: 135
作者:
Yu, Weiyuan
;
Li, Binbin
;
Wu, Baolei
;
Wang, Fengfeng
;
Wang, Mingkang
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2022/08/09
Binary alloys
Copper
Copper alloys
Indium alloys
Lead-free solders
Microstructure
Shear flow
Silicon carbide
Soldering
Temperature
Thermoelectric equipment
Wide band gap semiconductors
Composite solders
Electronics devices
In-45cu composite solder paste
Intermetallics compounds
Microstructures and mechanical properties
Service temperature
Shears strength
Solderpaste
Ultrasonic action time
Ultrasonic-assisted TLP
Spreading behavior of Sn droplets impacting Cu and stainless steel substrates
期刊论文
SURFACES AND INTERFACES, 2022, 卷号: 29
作者:
Wang, Xiwushan
;
Yu, Weiyuan
;
Wang, Mingkang
;
Wang, Fengfeng
;
Wu, Baolei
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2022/04/21
Metal droplets
Droplet impinging
Spreading
Droplet diameter
Contact angle
Effect of Ultrasonic Vibration Coupled with Direct Current on Wetting Behavior
期刊论文
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2022, 卷号: 51, 期号: 3, 页码: 800-805
作者:
Sun, Xuemin
;
Yu, Weiyuan
;
Wang, Fengfeng
;
Wu, Baolei
;
Wang, Yanhong
收藏
  |  
浏览/下载:19/0
  |  
提交时间:2022/06/20
Copper
Intermetallics
Nanocomposites
Precipitation (chemical)
Ultrasonic applications
Ultrasonic waves
Wetting
Cu substrate
Direct current method
Direct-current
Driving forces
Intermetallics compounds
Liquid solders
Power current
Ultrasonic-vibration
Wetting balance
Wetting behavior
Correlation Between Urine Formaldehyde and Cognitive Abilities in the Clinical Spectrum of Alzheimer's Disease
期刊论文
FRONTIERS IN AGING NEUROSCIENCE, 2022, 卷号: 14, 页码: 11
作者:
Wang, Ying
;
Pan, Fengfeng
;
Xie, Fang
;
He, Rongqiao
;
Guo, Qihao
收藏
  |  
浏览/下载:46/0
  |  
提交时间:2022/03/28
Alzhaimer's disease
urine formaldehyde
biomarker
APOE
beta-amylaoid
Effect of Electric Field on the Microstructure and Properties of Brazed Joints of Float Glass and Kovar 4J29
期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2021, 卷号: 50, 期号: 11, 页码: 4003-4009
作者:
Yu Weiyuan
;
Yang Guoqing
;
Sun Xuemin
;
Wang Fengfeng
;
Zhang Tao
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2022/03/01
ALTSAB
anodic bonding
soldering
float glass
Kovar
A scalable three-dimensional porous lambda-MnO2_rGO_Ca-alginate composite electroactive film with potential-responsive ion-pumping effect for selective recovery of lithium ions
期刊论文
SEPARATION AND PURIFICATION TECHNOLOGY, 2021, 卷号: 259
作者:
Zhang, Zheng
;
Du, Xiao
;
Wang, Qiang
;
Gao, Fengfeng
;
Jin, Tongtong
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2022/03/29
Effect of ultrasonic vibration on the wetting behavior of molten tin on copper substrate
期刊论文
Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 1, 页码: 1073-1079
作者:
Sun, Xuemin
;
Yu, Weiyuan
;
Wang, Fengfeng
;
Wang, Yanhong
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2021/03/02
Copper
Tin
Ultrasonic effects
Ultrasonic testing
Ultrasonic waves
Wetting
Acoustic cavitations
Additional forces
Copper substrates
Cross-section morphology
Interfacial atoms
Ultrasonic sound
Ultrasonic vibration
Wetting balance methods
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