Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi-2(Te,Se)(3) thermoelectric material

doi:10.1007/s10854-019-01852-6

CORC > 兰州理工大学 > 兰州理工大学 > 省部共建有色金属先进加工与再利用国家重点实验室

	Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi-2(Te,Se)(3) thermoelectric material
	Cheng, Jinxuan 1; Hu, Xiaowu 1; Li, Qinglin 2
刊名	JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
	2019-08
卷号	30 期号:15 页码:14791-14804
ISSN号	0957-4522
DOI	10.1007/s10854-019-01852-6
英文摘要	This research systematically investigated three joint systems (SAC305/Bi-2(Te,Se)(3), SAC305/Ni/Bi-2(Te,Se)(3) and SAC305/Cu/Bi-2(Te,Se)(3)) and compared the influence of Ni and Cu electrodeposits on the interfacial reaction. The thermoelectric material possessed an isotropic microstructure, and hence its surface had no significantly effects on deposited direction of Ni or Cu atoms. The crystal orientations of Ni and Cu grains were indexed to be (111) and (200), and no noticeable impure products were formed in these two electrodeposits. Compared with the defective Cu plating, fully crystallization of the Ni plating was more beneficial to the spreadability of solder, and this advantage could dramatically promote the reliability of solder joints. Under aging treatment at 160 degrees C for various hours to 360 h, heterogenetic compounds grew excessively in the SAC305/Bi-2(Te,Se)(3) couple, which could result in brittle failure. This reliability of this joint system was improved by depositing Ni or Cu on the substrate. However, the poor interfacial contact between the Cu coating and TE substrates severely resulted in the deterioration of mechanical properties of solder joints. In contrast, the SAC305/Ni/Bi-2(Te,Se)(3) system were more reliable during the whole aging period.
资助项目	Natural Science Foundation of Jiangxi Province[20161BAB206122]
WOS研究方向	Engineering ; Materials Science ; Physics
语种	英语
出版者	SPRINGER
WOS记录号	WOS:000478863500098
状态	已发表
内容类型	期刊论文
源URL	[http://119.78.100.223/handle/2XXMBERH/31683]
专题	省部共建有色金属先进加工与再利用国家重点实验室材料科学与工程学院
通讯作者	Hu, Xiaowu
作者单位	1.Nanchang Univ, Mech & Elect Engn Sch, Key Lab Robot & Welding Automat Jiangxi Prov, Nanchang 330031, Jiangxi, Peoples R China 2.Lanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou 730050, Gansu, Peoples R China
推荐引用方式 GB/T 7714	Cheng, Jinxuan,Hu, Xiaowu,Li, Qinglin. Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi-2(Te,Se)(3) thermoelectric material[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30(15):14791-14804.
APA	Cheng, Jinxuan,Hu, Xiaowu,&Li, Qinglin.(2019).Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi-2(Te,Se)(3) thermoelectric material.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,30(15),14791-14804.
MLA	Cheng, Jinxuan,et al."Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi-2(Te,Se)(3) thermoelectric material".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 30.15(2019):14791-14804.