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Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文
Microelectronics Reliability, 2022, 卷号: 135
作者:  Yu, Weiyuan;  Li, Binbin;  Wu, Baolei;  Wang, Fengfeng;  Wang, Mingkang
收藏  |  浏览/下载：15/0  |  提交时间：2022/08/09
Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint 期刊论文
MATERIALS, 2022, 卷号: 15, 期号: 14, 页码: 20
作者:  Zhang, Sinan;  Wang Z(王臻);  Wang, Jie;  Duan GH(段桂花);  Li, Haixia
收藏  |  浏览/下载：18/0  |  提交时间：2022/08/22
Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11
作者:  Chen, Yinbo;  Gao, Zhaoqing;  Liu, Zhi-Quan
收藏  |  浏览/下载：10/0  |  提交时间：2022/07/01
Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 11
作者:  Chen, Yinbo;  Wang, Changchang;  Gao, Yue;  Gao, Zhaoqing;  Liu, Zhi-Quan
收藏  |  浏览/下载：16/0  |  提交时间：2022/01/27
BV-Net: Bin-based Vector-predicted Network for tubular solder joint detection 期刊论文
MEASUREMENT, 2021, 卷号: 183, 页码: 8
作者:  Zhou, Chenlin;  Shen, Xiaofei;  Wang, Peng;  Wei, Wei;  Sun, Jia
收藏  |  浏览/下载：64/0  |  提交时间：2021/11/04
High-temperature aging time-induced composition and thickness evolution in the native oxides film on Sn solder substrate 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 20
作者:  Qiao, Chuang;  Sun, Xu;  Wang, Youzhi;  Hao, Long;  Liu, Xiahe
收藏  |  浏览/下载：17/0  |  提交时间：2021/11/22
Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints 期刊论文
MATERIALS CHARACTERIZATION, 2021, 卷号: 178, 页码: 8
作者:  Gao, Li-Yin;  Luo, Yi-Xiu;  Wan, Peng;  Liu, Zhi-Quan
收藏  |  浏览/下载：174/0  |  提交时间：2021/10/15
Progress in Functional Research of Amorphous Alloys 期刊论文
Xiyou Jinshu/Chinese Journal of Rare Metals, 2021, 卷号: 45, 期号: 8, 页码: 998-1009
作者:  Tian, Lin;  Li, Chunyan;  Zhai, Jianshu;  Lu, Yu;  Kou, Shengzhong
收藏  |  浏览/下载：25/0  |  提交时间：2022/02/17
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Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2021, 卷号: 50, 期号: 1, 页码: 258-262
作者:  Liu, C. Z.;  Wang, J. J.;  Zhu, M. W.;  Liu, X. M.;  Lu, T. N.
收藏  |  浏览/下载：25/0  |  提交时间：2021/02/03
ACR-Net: Attention Integrated and Cross-Spatial Feature Fused Rotation Network for Tubular Solder Joint Detection 期刊论文
IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 2021, 卷号: 70, 页码: 12
作者:  Zhou, Chenlin;  Li, Daheng;  Wang, Peng;  Sun, Jia;  Huang, Yikun
收藏  |  浏览/下载：32/0  |  提交时间：2021/11/03

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