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浏览/检索结果: 共7条，第1-7条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Novel spray coating process with polymer material applied in CIS wafer-level-packaging 会议论文 2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014, Singapore, Singapore 作者:  Yuechen Zhuang;  Daquan Yu;  Fengwei Dai;  Zhongcai Niu;  Wenqi Zhang 收藏  |  浏览/下载：31/0  |  提交时间：2015/09/01 Spray coating process with polymer material for insulation in CIS-TSV wafer-level-packaging 会议论文 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014, Chengdu, China 作者:  Yuechen Zhuang;  Daquan Yu;  Fengwei Dai;  Guoping Zhang;  Jun Fan 收藏  |  浏览/下载：33/0  |  提交时间：2015/09/01 FEM simulation of the thermo-mechanical behavior of TSV 3D MEMS structure 其他 2013-01-01 Gong, Xin; Chen, Jing; Lee, JongHo 收藏  |  浏览/下载：5/0  |  提交时间：2015/11/16 FEM simulation  thermo-mechanical  Though Silicon Via (TSV)  3D MEMS   Fabrication and in-situ evaluation of Copper TSV Interconnection 其他 2011-01-01 Mai, Shenglin; Zhu, Yunhui; Sun, Xin; Miao, Min; Chen, Jin; Jin, Yufeng 收藏  |  浏览/下载：1/0  |  提交时间：2015/11/16 SILICON  INTEGRATION   Fabrication and in-situ evaluation of copper TSV interconnection 其他 2011-01-01 Ma, Shenglin; Zhu, Yunhui; Sun, Xin; Miao, Min; Chen, Jin; Jin, Yufeng 收藏  |  浏览/下载：1/0  |  提交时间：2015/11/13 A Stress Relief Method for Copper Filled Through Silicon Via with Parylene on Sidewall 其他 2010-01-01 Kang, Wenping; Zhang, Maosheng; Zhu, Yunhui; Ma, Shenglin; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：3/0  |  提交时间：2015/11/16 Optical properties of semiconductor quantum-well material using photonic crystal fabricated by micro-fabrication machine 期刊论文 acta physica sinica, 2006, 卷号: 55, 期号: 3, 页码: 1248-1252 Xu XS; Xiong ZG; Sun ZH; Du W; Lu L; Chen HD; Jin AZ; Zhang DZ 收藏  |  浏览/下载：81/0  |  提交时间：2010/04/11 focused ion beam  electron beam lithography  photonic crystal  extraction efficiency  LIGHT EXTRACTION  SLAB