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	Fabrication and in-situ evaluation of Copper TSV Interconnection
	Mai, Shenglin ; Zhu, Yunhui ; Sun, Xin ; Miao, Min ; Chen, Jin ; Jin, Yufeng
	2011
关键词	SILICON INTEGRATION
英文摘要	In this paper, a process for making copper Though-Silicon-Via (TSV) interconnection is developed. In order to improve the yield of the process, challenging issues in the process is discussed and typical failures in the TSV interconnection are summarized. A measuring scheme is proposed to monitor these failures in the process and simulation is performed to testify the feasibility of the method.; http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000309781000025&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=8e1609b174ce4e31116a60747a720701 ; Engineering, Electrical & Electronic; CPCI-S(ISTP); 0
语种	英语
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/406078]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Mai, Shenglin,Zhu, Yunhui,Sun, Xin,et al. Fabrication and in-situ evaluation of Copper TSV Interconnection. 2011-01-01.

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