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	Novel spray coating process with polymer material applied in CIS wafer-level-packaging
	Yuechen Zhuang; Daquan Yu; Fengwei Dai; Zhongcai Niu; Wenqi Zhang; Zhenzhong Yong; Guoping Zhang
	2014
会议名称	2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014
会议地点	Singapore, Singapore
英文摘要	This paper studies a creative spray coating process applied to the forming of sidewall insulation of through silicon via (TSV) in CMOS image sensor (CIS)packaging. In this paper, through controlling the nitrogen gas pressure, rate ofpolymer solution flow and plate temperature, we present a low-temperature-first and high-temperature-last spray coating method. Using this novel spray coating process, one kind of phenolic aldehyde polymer is deposited on the sidewall of though silicon via with the diameter of 65μm and depth of 120μm. To promote the performance of TSV sidewall insulation and electrical interconnection characteristic, the thickness of polymer on the sidewall was aimed to not less than 2μm. The temperature of spray coating process was adjusted to control the viscosity of polymer to achieve the insulation layer thickness target value. Finally, we fabricate the adequate polymer insulation layers in the certain aspect ratio (2:1) TSV structure successfully.
收录类别	EI
语种	英语
内容类型	会议论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/5641]
专题	深圳先进技术研究院_集成所
作者单位	2014
推荐引用方式 GB/T 7714	Yuechen Zhuang,Daquan Yu,Fengwei Dai,et al. Novel spray coating process with polymer material applied in CIS wafer-level-packaging[C]. 见:2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014. Singapore, Singapore.

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