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The effect of nickel-induced finite plasticity on the tribological behavior and wear resistance of Cu-Sn-Bi alloy
期刊论文
Tribology International, 2023, 卷号: 188, 期号: -, 页码: 108909
作者:
Li ZY(李振宇)
;
Wang HG(王宏刚)
;
Zhao GR(赵更锐)
;
Gao G(高贵)
;
Li JJ(李佳骏)
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2023/11/02
Chronology and critical metals enrichment mechanism of ferromanganese nodules from the Parece Vela Basin, Philippine Sea
期刊论文
CHEMICAL GEOLOGY, 2023, 卷号: 630, 页码: 12
作者:
Cheng, Yulong
;
Xu, Yonghang
;
Yi, Liang
;
Li, Dongyi
;
Lin, Fanyu
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2023/12/13
In situ geochemical analysis
Magnetic scanning
Enrichment mechanism
Ferromanganese nodules
Parece Vela Basin
Maternal urinary metal(loid)s and risk of preterm birth: A cohort study in the Tibetan Plateau
期刊论文
ENVIRONMENTAL POLLUTION, 2023, 卷号: 333
作者:
Zhao, Lei
;
Wang, Shulin
;
Liu, Miao
;
Cao, Zhongqiang
;
Xiao, Yuancan
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  |  
浏览/下载:0/0
  |  
提交时间:2023/12/01
Precise/small sample size determination of stable Cd isotope ratios of geological samples with double spike MC-ICP-MS
期刊论文
JOURNAL OF ANALYTICAL ATOMIC SPECTROMETRY, 2022, 卷号: 37, 期号: 11, 页码: 2470-2479
作者:
Guo, Chao
;
Li, Tao(李涛)
;
Li, Gaojun
;
Chen, Tianyu
;
Li, Le
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  |  
浏览/下载:15/0
  |  
提交时间:2022/11/17
Study of the dynamic wetting behavior of Sn droplet impacting Cu substrate
期刊论文
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2022, 卷号: 128, 期号: 8
作者:
Yu, Weiyuan
;
Wang, Mingkang
;
Wang, Fengfeng
;
Wang, Xiwushan
;
Wu, Baolei
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  |  
浏览/下载:15/0
  |  
提交时间:2022/07/19
Droplet impaction
Droplet solidification
Dynamic wetting behavior
Thermal spraying
Jet formation
Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint
期刊论文
MATERIALS, 2022, 卷号: 15, 期号: 14, 页码: 20
作者:
Zhang, Sinan
;
Wang Z(王臻)
;
Wang, Jie
;
Duan GH(段桂花)
;
Li, Haixia
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  |  
浏览/下载:20/0
  |  
提交时间:2022/08/22
Cu/SAC305/Cu solder joints
in situ tensile test
fracture analysis
X-ray mu-CT
FE simulation
Research on Bi contents addition into Sn-Cu-based lead-free solder alloy
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 19, 页码: 15586-15603
作者:
Huang, Hai
;
Chen, Bin
;
Hu, Xiaowu
;
Jiang, Xiongxin
;
Li, Qinglin
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  |  
浏览/下载:88/0
  |  
提交时间:2022/07/19
Binary alloysCopper corrosionCorrosion protectionCorrosion resistanceCorrosion resistant alloysCorrosive effectsDifferential scanning calorimetryElectrochemical corrosionElectrochemical impedance spectroscopyLead alloysLead-free soldersPassivationScanning electron microscopySemiconductor dopingTensile strengthThermodynamic propertiesTin alloysVickers hardness
Cu-basedElectrochemicalsLead-free solder alloyMechanical performanceMechanical resistanceSolder alloysUndercoolingsUniversal testing machinesVicker hardnessX- ray diffractions
Electrodeposited Ni-W coatings as the effective reaction barrier at Ga-21.5In-10Sn/Cu interfaces
期刊论文
SURFACES AND INTERFACES, 2022, 卷号: 30, 页码: 12
作者:
Gao, Zhaoqing
;
Wang, Chen
;
Gao, Nan
;
Guo, Shihao
;
Chen, Yinbo
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  |  
浏览/下载:26/0
  |  
提交时间:2022/07/01
Ni-W-graphene coatings
Interfacial reaction barrier
CuGa 2 layer
Ga-21
5In-10Sn liquid alloys
Ni -W solid solution
Construction of a Cu-Sn Heterojunction Interface Derived from a Schottky Junction in Cu@Sn/rGO Composites as a Highly Efficient Dielectric Microwave Absorber (vol 13, pg 11911, 2021)
期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2022, 卷号: 14, 期号: 20, 页码: 24070-24070
作者:
Li, Tiantian
;
Xia, Long
;
Yang, Hua
;
Wang, Xinyu
;
Zhang, Tao
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2022/07/19
Interfacial reactions at Ga-21.5In-10Sn/Cu liquid-solid interfaces under isothermal and non-isothermal conditions
期刊论文
MATERIALS CHEMISTRY AND PHYSICS, 2022, 卷号: 282, 页码: 16
作者:
Gao, Zhaoqing
;
Wang, Chen
;
Chai, Zhenbang
;
Chen, Yinbo
;
Shen, Chenyu
收藏
  |  
浏览/下载:24/0
  |  
提交时间:2022/07/14
Intermetallics
Microstructure
Temperature gradient
Preferred orientation
Ga-21-5In-10Sn alloys
Interfaces
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