Study of the dynamic wetting behavior of Sn droplet impacting Cu substrate

doi:10.1007/s00339-022-05795-4

	Study of the dynamic wetting behavior of Sn droplet impacting Cu substrate
	Yu, Weiyuan 1,2; Wang, Mingkang 1,2; Wang, Fengfeng 1,2,3; Wang, Xiwushan 1,2; Wu, Baolei 1,2
刊名	APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
	2022-08-01
卷号	128 期号:8
关键词	Droplet impaction Droplet solidification Dynamic wetting behavior Thermal spraying Jet formation
ISSN号	0947-8396
DOI	10.1007/s00339-022-05795-4
英文摘要	The spreading and wetting behavior of metal droplets impacting substrate surface has an important influence on the quality of jet forming, additive manufacturing, and other products. Nonetheless, due to the high speed and complexity of the impact process, there are few studies on the impact behavior of metal droplet impacting metal substrate. In this paper, the dynamic wetting behavior of Sn droplet impinging on Cu substrate is studied by simulation and experiment. Numerical simulation uses CLSVOF method to establish a single droplet of tin impact on cold copper substrate (temperature below 230 celcius) model. The effects of substrate temperature (50-200 celcius), droplet impact velocity (1-6 m/s) and substrate average roughness (0.05 mu m, 0.1 mu m, 0.5 mu m, 1 mu m, and smooth surface) on droplet spreading behavior were investigated. The spreading and wetting behavior of the single droplet liquid impinging on a cold copper substrate was studied by a high-speed camera. The results show that the substrate temperature has a great influence on the droplet spreading process and the final spreading factor but has little influence on the final contact angle. The droplet impact velocity has a great influence on the droplet spreading process, the final spreading factor, and the final contact angle. The average surface roughness of the substrate has little effect on the whole spreading process, but the final contact angle decreases first and then increases with the increase of surface roughness. The results reflect the morphology change of the droplet spreading solidification process, and explain the dynamic wetting state of the droplet spreading more directly.
WOS研究方向	Materials Science ; Physics
语种	英语
出版者	SPRINGER HEIDELBERG
WOS记录号	WOS:000821604000003
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/158920]
专题	实验室建设与管理处
作者单位	1.Lanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou 730050, Gansu, Peoples R China; 2.Lanzhou Univ Technol, Sch Mat Sci & Engn, Lanzhou 730050, Gansu, Peoples R China; 3.Chinese Acad Sci, Inst Modem Phys, Nanchang Rd, Lanzhou 730000, Gansu, Peoples R China
推荐引用方式 GB/T 7714	Yu, Weiyuan,Wang, Mingkang,Wang, Fengfeng,et al. Study of the dynamic wetting behavior of Sn droplet impacting Cu substrate[J]. APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,2022,128(8).
APA	Yu, Weiyuan,Wang, Mingkang,Wang, Fengfeng,Wang, Xiwushan,&Wu, Baolei.(2022).Study of the dynamic wetting behavior of Sn droplet impacting Cu substrate.APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,128(8).
MLA	Yu, Weiyuan,et al."Study of the dynamic wetting behavior of Sn droplet impacting Cu substrate".APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING 128.8(2022).