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浏览/检索结果: 共1条，第1-1条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 Research on Bi contents addition into Sn-Cu-based lead-free solder alloy 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 19, 页码: 15586-15603 作者:  Huang, Hai;  Chen, Bin;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin 收藏  |  浏览/下载：85/0  |  提交时间：2022/07/19 Binary alloysCopper corrosionCorrosion protectionCorrosion resistanceCorrosion resistant alloysCorrosive effectsDifferential scanning calorimetryElectrochemical corrosionElectrochemical impedance spectroscopyLead alloysLead-free soldersPassivationScanning electron microscopySemiconductor dopingTensile strengthThermodynamic propertiesTin alloysVickers hardness  Cu-basedElectrochemicalsLead-free solder alloyMechanical performanceMechanical resistanceSolder alloysUndercoolingsUniversal testing machinesVicker hardnessX- ray diffractions