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浏览/检索结果: 共9条，第1-9条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Interfacial reactions at Ga-21.5In-10Sn/Cu liquid-solid interfaces under isothermal and non-isothermal conditions 期刊论文 MATERIALS CHEMISTRY AND PHYSICS, 2022, 卷号: 282, 页码: 16 作者:  Gao, Zhaoqing;  Wang, Chen;  Chai, Zhenbang;  Chen, Yinbo;  Shen, Chenyu 收藏  |  浏览/下载：25/0  |  提交时间：2022/07/14 Intermetallics  Microstructure  Temperature gradient  Preferred orientation   Ga-21-5In-10Sn alloys   Interfaces   Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9 作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan 收藏  |  浏览/下载：46/0  |  提交时间：2021/02/02 Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism   Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9 作者:   收藏  |  浏览/下载：42/0  |  提交时间：2021/02/02 Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism   Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Intermetallics  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Packaging materials  Soldered joints  Soldering  Soldering alloys  Surface chemistry  Thermal expansion   Effects of Pb content on solidification behavior and microstructure on mixed solder alloy (EI收录) 会议论文 Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China, August 11, 2013 - August 14, 2013 作者:  Wei, Xiongfeng[1,2];  Li, Xunping[2];  Zhoubin[2];  Wei, Guoqiang[1] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/15 Alloys  Electronics packaging  Eutectics  Lead  Microstructural evolution  Microstructure  Phase diagrams  Silver  Silver alloys  Soldering  Soldering alloys  Solidification  Tin alloys   Study on the optimization and analysis of the Mixed Reflow soldering with lead and lead-free solder in the high density assembly (EI收录) 会议论文 ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012 作者:  Huang, Yinglei[1];  Wu, Zhaohua[1];  Liu, Zhengwei[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Belt conveyors  Electric switches  Electronics packaging  Lead  Optimization  Preheating  Soldering  Soldering alloys  Welding   Processing performance and microstructure of Sn-Zn based solders modified by Bi and mixed rare earth elements (EI收录) 会议论文 ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012 作者:  Huang, Jia-Qiang[1];  Zhou, Min-Bo[1];  Li, Chang-Zheng[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Differential scanning calorimetry  Electronics packaging  Melting point  Microstructural evolution  Soldering  Soldering alloys  Wetting  Zinc   Influence of mixed rare earth addition on the microstructure of the Sn-Cu-Ni solder and interfacial reaction of Cu/Sn-Cu-Ni/Cu joints (EI收录) 会议论文 ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, August 8, 2011 - August 11, 2011 作者:  Li, Wei[1];  Zhou, Min-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/15 Cerium  Copper alloys  Electronics packaging  Intermetallics  Lanthanum  Microstructure  Packaging  Rare earth additions  Rare earths  Soldering alloys  Tin alloys   Undercooling behavior and solidification microstructure evolution of Sn-Cu-Ni solders modified by minute amount of mixed rare earth La-Ce (EI收录) 会议论文 Materials Science Forum, Cairns, QLD, Australia, August 2, 2010 - August 6, 2010 作者:  Zhou, Minbo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/16 Biology  Cerium  Cerium compounds  Copper alloys  Crystallization  Dendrimers  Electronics packaging  Grain growth  Intermetallics  Lanthanum  Lead  Microstructure  Rare earths  Silver  Soldering alloys  Tin alloys  Undercooling