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	Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录)
	Huang, Jia-Qiang[1,2]; Zhou, Min-Bo[1]; Zhang, Xin-Ping[1,2]
关键词	Ball grid arrays Electronics packaging Intermetallics Isotherms Lead free solders Microstructural evolution Microstructure Packaging materials Soldered joints Soldering Soldering alloys Surface chemistry Thermal expansion
会议地点	Wuhan, China
URL标识	查看原文
内容类型	会议
URI标识	http://www.corc.org.cn/handle/1471x/2039144
专题	华南理工大学
推荐引用方式 GB/T 7714	Huang, Jia-Qiang[1,2],Zhou, Min-Bo[1],Zhang, Xin-Ping[1,2].Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录).

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