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	Study on the optimization and analysis of the Mixed Reflow soldering with lead and lead-free solder in the high density assembly (EI收录)
	Huang, Yinglei[1]; Wu, Zhaohua[1]; Liu, Zhengwei[2]
会议名称	ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging
会议日期	August 13, 2012 - August 16, 2012
会议地点	Guilin, China
关键词	Belt conveyors Electric switches Electronics packaging Lead Optimization Preheating Soldering Soldering alloys Welding
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2054763
专题	华南理工大学
作者单位	1.[1] School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, China 2.[2] CETC, No. 10 Research Institute, Chengdu, 61000, China
推荐引用方式 GB/T 7714	Huang, Yinglei[1],Wu, Zhaohua[1],Liu, Zhengwei[2]. Study on the optimization and analysis of the Mixed Reflow soldering with lead and lead-free solder in the high density assembly (EI收录)[C]. 见:ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging. Guilin, China. August 13, 2012 - August 16, 2012.

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