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浏览/检索结果: 共1条，第1-1条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 Study on the optimization and analysis of the Mixed Reflow soldering with lead and lead-free solder in the high density assembly (EI收录) 会议论文 ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012 作者:  Huang, Yinglei[1];  Wu, Zhaohua[1];  Liu, Zhengwei[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Belt conveyors  Electric switches  Electronics packaging  Lead  Optimization  Preheating  Soldering  Soldering alloys  Welding