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Microstructure evolution and wear mechanism of in situ prepared Ti–TiN cermet layers at high temperature 期刊论文
Composites Part B: Engineering, 2022, 卷号: 242
作者:  Cheng, Qianqian;  Zhang, Penglin;  Ma, Xiaoguang;  Wan, Shanhong;  Jialin chen
收藏  |  浏览/下载:17/0  |  提交时间:2022/07/20
Compositional interpretation of high elasticity Cu–Ni–Sn alloys using cluster-plus-glue-atom model 期刊论文
Journal of Materials Research and Technology, 2022, 卷号: 17, 页码: 1246-1258
作者:  Yang, M.;  Hu, Y.L.;  Li, X.N.;  Li, Z.M.;  Zheng, Y.H.
收藏  |  浏览/下载:9/0  |  提交时间:2022/04/21
A simultaneous enhancement of both strength and ductility by a novel differential-thermal ECAP process in Mg-Sn-Zn-Zr alloy 期刊论文
Journal of Alloys and Compounds, 2022, 卷号: 889
作者:  Zhou, Tianshui;  Zhang, Quanfa;  Li, Qianqian;  Wang, Lidong;  Li, Qinglin
收藏  |  浏览/下载:29/0  |  提交时间:2022/02/17
Wetting of substoichiometric YSZ2-x by molten Sn-based active alloys at 800–900 °C 期刊论文
Ceramics International, 2022, 卷号: 48, 期号: 20, 页码: 30621-30629
作者:  Sui, Ran;  Tan, Kaihui;  Lin, Qiaoli;  Xie, Kaibin
收藏  |  浏览/下载:18/0  |  提交时间:2022/08/09
Microstructure and tribological behaviors of diffusion bonded powder sintered Cu–Sn based alloys 期刊论文
Materials Research Express, 2021, 期号: 8, 页码: 116505
作者:  Li Zhenyu;  Zhao Gengrui;  Wang Honggang;  Gao Gui;  Chen Shengsheng
收藏  |  浏览/下载:21/0  |  提交时间:2021/11/22
Microstructure and tribological behaviors of diffusion bonded powder sintered Cu-Sn based alloys 期刊论文
MATERIALS RESEARCH EXPRESS, 2021, 卷号: 8, 期号: 11
作者:  Li, Zhenyu;  Zhao, Gengrui;  Wang, Honggang;  Gao, Gui;  Chen, Shengsheng
收藏  |  浏览/下载:18/0  |  提交时间:2021/12/17
Influence of microstructure on the fatigue crack growth behavior of a near-alpha TWIP Ti alloy 期刊论文
Materials Characterization, 2021, 卷号: 178
作者:  Wang, Qi;  Ren, Junqiang;  Zhang, Binbin;  Xin, Chao;  Wu, Yukun
收藏  |  浏览/下载:8/0  |  提交时间:2022/02/17
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration 期刊论文
Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:  Qiu, Hongyu;  Xu, Han;  Zhang, Chuge;  Hu, Xiaowu;  Jiang, Xiongxin
收藏  |  浏览/下载:12/0  |  提交时间:2022/02/17
Wetting of SiC by molten Cu–20Me–2Cr (Me=Ag, Mn, Si, and Sn) alloys at 1373 K 期刊论文
Vacuum, 2021, 卷号: 185
作者:  Lin, Qiaoli;  Liu, Lu;  Yang, Hongyu;  Li, Liumeng
收藏  |  浏览/下载:2/0  |  提交时间:2021/03/02
Generalized stacking fault energies and critical resolved shear stresses of random alpha-Ti-Al alloys from first-principles calculations 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2021, 卷号: 850, 页码: 11
作者:  Yu, Hui;  Cao, Shuo;  Youssef, Sabry S.;  Ma, Ying-Jie;  Lei, Jia-Feng
收藏  |  浏览/下载:49/0  |  提交时间:2021/02/02


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