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A Chip-Level Optical Interconnect for CPU 期刊论文
IEEE PHOTONICS TECHNOLOGY LETTERS, 2021, 卷号: 33, 期号: 16, 页码: 852-855
作者:  Hao, Qinfen;  Qin, Mengyuan;  Qi, Nan;  Xue, Haiyun;  Han, Meng
收藏  |  浏览/下载：48/0  |  提交时间：2021/12/01
Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 4359-4369
作者:  Huang, Ru;  Ma, Haoran;  Shang, Shengyan;  Kunwar, Anil;  Wang, Yunpeng
收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02
Fatigue lifetime analysis of the electronic packaging structures under the combined thermal stress and vibration loading conditions [热振加载条件下电子封装结构的疲劳寿命分析] 期刊论文
Xi'an Dianzi Keji Daxue Xuebao/Journal of Xidian University, 2019, 卷号: 46, 页码: 54-60
作者:  Zhao, F.;  Qiu, Y.;  Jia, F.;  Ma, H.
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/30
Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1254-1262
作者:  Jiang, Chengshuo;  Fan, Jiajie;  Qian, Cheng;  Zhang, Hao;  Fan, Xuejun
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30
Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs 会议论文
Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018
作者:  Wang, Z.;  Fan, J.;  Liu, J.;  Hu, A.;  Qian, C.
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/30
Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Wang, Zhen;  Fan, Jiajie;  Liu, Jie;  Hu, Aihua;  Qian, Cheng
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/30
Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:  Nie, Zhiqiang;  Wu, Di;  Lu, Yao;  Wu, Dhai;  Wang, Shuna
收藏  |  浏览/下载：85/0  |  提交时间：2016/11/22
A compact QCW conduction-cooled high power semiconductor laser array 会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:  Zhu, Qiwen;  Zhang, Pu;  Wang, Shuna;  Wu, Dihai;  Nie, Zhiqiang
收藏  |  浏览/下载：25/0  |  提交时间：2016/11/22
A full chip scale numerical simulation method for thermal management of 3D IC 其他
2016-01-01
Wang, Ningyu; Jin, Yufeng; Pi, Yudan; Wang, Wei
收藏  |  浏览/下载：8/0  |  提交时间：2017/12/03
An Accurate Calculation Method on Thermal Effectiveness of TSV and Wire 其他
2016-01-01
Pi, Yudan; Wang, Wei; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03

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