| Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows | |
| Huang, Ru; Ma, Haoran; Shang, Shengyan; Kunwar, Anil; Wang, Yunpeng; Ma, Haitao | |
| 刊名 | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
 |
| 2019 | |
| 卷号 | 30页码:4359-4369 |
| 关键词 | Chip scale packages Copper Copper alloys Flip chip devices Grain boundaries Growth rate Size determination Soldered joints Substrates Tin alloys, Electronic product Grain boundary motions Interface reactions Lateral growth rates Longitudinal growth Packaging process Packaging technologies Solder composition, Soldering |
| ISSN号 | 0957-4522 |
| URL标识 | 查看原文 |
| WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3220263 |
| 专题 | 大连理工大学 |
| 作者单位 | 1.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China. 2.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China. 3.Dalian Univ Technol, Sch Microelect, Dalian 116024, Peoples R China. 4.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China. 5.Katholieke Univ Leuven, Dept Mat Engn, Kasteelpk Arenberg 44, B-3001 Heverlee, Belgium. |
| 推荐引用方式 GB/T 7714 | Huang, Ru,Ma, Haoran,Shang, Shengyan,et al. Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30:4359-4369. |
| APA | Huang, Ru,Ma, Haoran,Shang, Shengyan,Kunwar, Anil,Wang, Yunpeng,&Ma, Haitao.(2019).Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,30,4359-4369. |
| MLA | Huang, Ru,et al."Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 30(2019):4359-4369. |
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