| Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs | |
| Wang, Zhen; Fan, Jiajie; Liu, Jie; Hu, Aihua; Qian, Cheng; Fan, Xuejun; Zhang, Guoqi | |
| 2018 | |
| 会议名称 | 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) |
| 会议日期 | 2018-01-01 |
| 关键词 | LED Chip scale package Phosphor/silicone composites Viscosity Optimal cure process |
| 页码 | 525-530 |
| 收录类别 | CPCI-S |
| URL标识 | 查看原文 |
| WOS记录号 | WOS:000450155700115 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5928594 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | Wang, Zhen,Fan, Jiajie,Liu, Jie,et al. Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs[C]. 见:2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). 2018-01-01. |
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