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金属研究所 [52]
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期刊论文 [52]
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Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint
期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11
作者:
Chen, Yinbo
;
Gao, Zhaoqing
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2022/07/01
Sn-Bi-Ag solder
Grain orientation
Temperature gradient
Aging
Ag3Sn
Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 11
作者:
Chen, Yinbo
;
Wang, Changchang
;
Gao, Yue
;
Gao, Zhaoqing
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2022/01/27
High-temperature aging time-induced composition and thickness evolution in the native oxides film on Sn solder substrate
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 20
作者:
Qiao, Chuang
;
Sun, Xu
;
Wang, Youzhi
;
Hao, Long
;
Liu, Xiahe
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2021/11/22
Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints
期刊论文
MATERIALS CHARACTERIZATION, 2021, 卷号: 178, 页码: 8
作者:
Gao, Li-Yin
;
Luo, Yi-Xiu
;
Wan, Peng
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:228/0
  |  
提交时间:2021/10/15
Solder joint
Intermetallic compound
Mechanical property
Nano-indentation
First principle calculation
Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects
期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2021, 卷号: 50, 期号: 1, 页码: 258-262
作者:
Liu, C. Z.
;
Wang, J. J.
;
Zhu, M. W.
;
Liu, X. M.
;
Lu, T. N.
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  |  
浏览/下载:25/0
  |  
提交时间:2021/02/03
Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging
期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2020, 卷号: 33, 期号: 10, 页码: 9
作者:
Wang, Changchang
;
Chen, Yinbo
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2021/02/02
Cu-Sn IMC
Growth behavior
External stress effect
Isothermal aging
Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder
期刊论文
MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9
作者:
Meng, Zhi-Chao
;
Gao, Li-Yin
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2021/02/02
Sn nanowire
Template electrodeposition
Microstructural characterization
Liquid bath melting
Lead-free solder
Melting point
Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder
期刊论文
MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9
作者:
Meng, Zhi-Chao
;
Gao, Li-Yin
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2021/02/02
Sn nanowire
Template electrodeposition
Microstructural characterization
Liquid bath melting
Lead-free solder
Melting point
Structure and properties of Sn-Cu lead-free solders in electronics packaging
期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
作者:
Zhao, Meng
;
Zhang, Liang
;
Liu, Zhi-Quan
;
Xiong, Ming-Yue
;
Sun, Lei
收藏
  |  
浏览/下载:129/0
  |  
提交时间:2021/02/02
Sn-Cu
microstructures
IMC
mechanical properties
Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder
期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
作者:
Cao Lihua
;
Chen Yinbo
;
Shi Qiyuan
;
Yuan Jie
;
Liu Zhiquan
收藏
  |  
浏览/下载:129/0
  |  
提交时间:2021/02/02
alloy element
Sn-Ag-Cu solder
intermetallic compound
interfacial morphology
shear strength
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