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科研机构
上海大学 [7]
江苏大学 [1]
新疆农业大学 [1]
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期刊论文 [5]
会议论文 [4]
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2019 [2]
2018 [2]
2017 [5]
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Manufacturing Graphene-Encapsulated Copper Particles by Chemical Vapor Deposition in a Cold Wall Reactor
期刊论文
CHEMISTRYOPEN, 2019, 卷号: 8, 页码: 58-63
作者:
Chen, Shujing[1]
;
Zehri, Abdelhafid[2]
;
Wang, Qianlong[3]
;
Yuan, Guangjie[4]
;
Liu, Xiaohua[5]
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2019/04/22
cold wall reactor
copper particles
graphene
oxidation resistance
thermal conductivity
The Semiconductor/Conductor Interface Piezoresistive Effect in an Organic Transistor for Highly Sensitive Pressure Sensors
期刊论文
ADVANCED MATERIALS, 2019, 卷号: 31, 页码: e1805630
作者:
Wang, Zhongwu[1]
;
Guo, Shujing[2]
;
Li, Hongwei[3]
;
Wang, Bin[4]
;
Sun, Yongtao[5]
收藏
  |  
浏览/下载:37/0
  |  
提交时间:2019/04/22
field-effect
piezoresistive effect
pressure sensors
transistors
tunable sensitivity
Highly Thermally Conductive and Light Weight Copper/Graphene Film Laminated composites for Cooling Applications
会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:
Wang, Nan[1]
;
Chen, Shujing[2]
;
Nkansah, Amos[3]
;
Darmawan, Christian Chandra[4]
;
Ye, Lilei[5]
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2019/04/22
Graphene film
Lamination
Light-weight
Thermal resistance
Tailoring the Thermal and Mechanical Properties of Graphene Film by Structural Engineering
期刊论文
SMALL, 2018, 卷号: 14, 页码: e1801346
作者:
Wang, Nan[1]
;
Samani, Majid Kabiri[2]
;
Li, Hu[3]
;
Dong, Lan[4]
;
Zhang, Zhongwei[5]
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2019/04/22
grain size
graphene films
phonon transfer
thermal conductivity
turbostratic-stacking
An Overview of Carbon Nanotubes Based Interconnects for Microelectronic Packaging
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Chen, Shujing[1]
;
Shan, Bo[2]
;
Yang, Yiqun[3]
;
Yuan, Guangjie[4]
;
Huang, Shirong[5]
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2019/04/24
Interconnect
CNTs based bumps
CNTs basednTSVs
resistivity
CNTs-Cu nanocomposite
Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Huang, Shirong[1]
;
Ke, Wei[2]
;
Yang, Yiqun[3]
;
Ye, Hui[4]
;
Chen, Shujing[5]
收藏
  |  
浏览/下载:41/0
  |  
提交时间:2019/04/24
Graphene protection barrier
Cu-Plated PCB
Reliability
Graphene-based Heat Spreading Materials for Electronics Packaging Applications
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Yuan, Guangjie[1]
;
Shan, Bo[2]
;
Chen, Shujing[3]
;
Yang, Yiqun[4]
;
Bao, Jie[5]
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/04/24
heat spreading materials
graphene-based film
graphene-based electrically conductive adhesive
electronics packaging
Effects of heat treatment on the microstructure and properties of TiO2 based film by plasma electrolytic oxidation
期刊论文
MONATSHEFTE FUR CHEMIE, 2017, 卷号: 148, 期号: 7, 页码: 1185-1190
作者:
Wang, Yunlong[1]
;
Ye, Shuhang[2]
;
Zhu, Linzhong[3]
;
Chen, Fei[4]
;
Shi, Shujing[5]
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/12/24
TiO2 composite film
TiO2 film
Photocatalytic activity
Plasma electrolytic oxidation
Heat treatment
Genome re-sequencing reveals the history of apple and supports a two-stage model for fruit enlargement
期刊论文
2017, 卷号: 8, 期号: 1
作者:
Duan, Naibin[1,2]
;
Bai, Yang[3]
;
Sun, Honghe[3]
;
Wang, Nan[1]
;
Ma, Yumin[2]
收藏
  |  
浏览/下载:36/0
  |  
提交时间:2019/12/28
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