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	Highly Thermally Conductive and Light Weight Copper/Graphene Film Laminated composites for Cooling Applications
	Wang, Nan[1]; Chen, Shujing[2]; Nkansah, Amos[3]; Darmawan, Christian Chandra[4]; Ye, Lilei[5]; Liu, Johan[6]
	2018
会议名称	2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
会议日期	2018-01-01
关键词	Graphene film Lamination Light-weight Thermal resistance
页码	1588-1592
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2169591
专题	上海大学
作者单位	1.[1]SHT Smart High Tech AB, Gothenburg, Sweden. 2.[2]Shanghai Univ, Sch Automat & Mech Engn, SMIT Ctr, Shanghai, Peoples R China. 3.[3]SHT Smart High Tech AB, Gothenburg, Sweden. 4.[4]SHT Smart High Tech AB, Gothenburg, Sweden. 5.[5]SHT Smart High Tech AB, Gothenburg, Sweden. 6.[6]Shanghai Univ, Sch Automat & Mech Engn, SMIT Ctr, Shanghai, Peoples R China. 7.Chalmers Univ Technol, Dept Microtechnol & Nanosci, Gothenburg, Sweden.
推荐引用方式 GB/T 7714	Wang, Nan[1],Chen, Shujing[2],Nkansah, Amos[3],et al. Highly Thermally Conductive and Light Weight Copper/Graphene Film Laminated composites for Cooling Applications[C]. 见:2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). 2018-01-01.

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