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浏览/检索结果: 共10条，第1-10条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 Manufacturing Graphene-Encapsulated Copper Particles by Chemical Vapor Deposition in a Cold Wall Reactor 期刊论文 CHEMISTRYOPEN, 2019, 卷号: 8, 页码: 58-63 作者:  Chen, Shujing[1];  Zehri, Abdelhafid[2];  Wang, Qianlong[3];  Yuan, Guangjie[4];  Liu, Xiaohua[5] 收藏  |  浏览/下载：16/0  |  提交时间：2019/04/22 cold wall reactor  copper particles  graphene  oxidation resistance  thermal conductivity   Chemical Vapor Deposition of Vertically Aligned Carbon Nanotube Arrays: Critical Effects of Oxide Buffer Layers 期刊论文 Nanoscale research letters, 2019, 卷号: 14, 页码: 106 作者:  Li Haohao[1];  Yuan Guangjie[2];  Shan Bo[3];  Zhang Xiaoxin[4];  Ma Hongping[5] 收藏  |  浏览/下载：32/0  |  提交时间：2019/04/22 Atomic layer deposition  Chemical vapor deposition  Oxide buffer layers  Vertically aligned carbon nanotubes   Atomic layer deposition of buffer layers for the growth of vertically aligned carbon nanotube arrays 期刊论文 Nanoscale Research Letters, 2019, 卷号: 14, 页码: 119 作者:  Haohao Li[1];  Guangjie Yuan[2];  Bo Shan[3];  Xiaoxin Zhang[4];  Hongping Ma[5] 收藏  |  浏览/下载：30/0  |  提交时间：2019/04/22 Atomic layer deposition  Oxide buffer layers  Thermal interface materials  Vertically aligned carbon nanotube arrays   Critical atomic-level processing technologies: Remote plasma-enhanced atomic layer deposition and atomic layer etching 期刊论文 Micro and Nanosystems, 2018, 卷号: 10, 页码: 76-83 作者:  Guangjie Yuan[1];  Haohao Li[2];  Bo Shan[3];  Johan Liu[4] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/22 Tailoring the Thermal and Mechanical Properties of Graphene Film by Structural Engineering 期刊论文 SMALL, 2018, 卷号: 14, 页码: e1801346 作者:  Wang, Nan[1];  Samani, Majid Kabiri[2];  Li, Hu[3];  Dong, Lan[4];  Zhang, Zhongwei[5] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/22 grain size  graphene films  phonon transfer  thermal conductivity  turbostratic-stacking   An Overview of Carbon Nanotubes Based Interconnects for Microelectronic Packaging 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Chen, Shujing[1];  Shan, Bo[2];  Yang, Yiqun[3];  Yuan, Guangjie[4];  Huang, Shirong[5] 收藏  |  浏览/下载：17/0  |  提交时间：2019/04/24 Interconnect  CNTs based bumps  CNTs basednTSVs  resistivity  CNTs-Cu nanocomposite   Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Huang, Shirong[1];  Ke, Wei[2];  Yang, Yiqun[3];  Ye, Hui[4];  Chen, Shujing[5] 收藏  |  浏览/下载：41/0  |  提交时间：2019/04/24 Graphene protection barrier  Cu-Plated PCB  Reliability   Graphene-based Heat Spreading Materials for Electronics Packaging Applications 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Yuan, Guangjie[1];  Shan, Bo[2];  Chen, Shujing[3];  Yang, Yiqun[4];  Bao, Jie[5] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/24 heat spreading materials  graphene-based film  graphene-based electrically conductive adhesive  electronics packaging   The Effects of Graphene-Based Films as Heat Spreaders for Thermal Management in Electronic Packaging 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), 2016-08-16 作者:  Huang, Shirong[1];  Bao, Jie[2];  Ye, Hui[3];  Wang, Ning[4];  Yuan, Guangjie[5] 收藏  |  浏览/下载：9/0  |  提交时间：2019/04/26 Graphene-based film  Thermal performance  Finite element analysis  Electronic packaging   A Brief Overview of Atomic Layer Deposition and Etching in the Semiconductor Processing 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), 2016-08-16 作者:  Yuan, Guangjie[1];  Wang, Ning[2];  Huang, Shirong[3];  Liu, Johan[4] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/26 atomic layer deposition  atomic layer etching  self-limiting behavior  semiconductor processing