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CORC

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Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating 期刊论文
JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, 2020, 卷号: 498, 页码: 6
作者:  Gao, Li-Yin;  Wan, Peng;  Liu, Zhi-Quan
收藏  |  浏览/下载：6/0  |  提交时间：2021/02/02
Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating 期刊论文
JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, 2020, 卷号: 498, 页码: 6
作者:  Gao, Li-Yin;  Wan, Peng;  Liu, Zhi-Quan
收藏  |  浏览/下载：10/0  |  提交时间：2021/02/02
Wafer-level optoelectronic packaging 专利
专利号: WO2019086953A1, 申请日期: 2019-05-09, 公开日期: 2019-05-09
作者:  LAM, YEE, LOY
收藏  |  浏览/下载：15/0  |  提交时间：2019/12/30
Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 8, 页码: 1305-1314
作者:  Gao, LY;  Zhang, H;  Li, CF;  Guo, JD;  Liu, ZQ
收藏  |  浏览/下载：29/0  |  提交时间：2018/12/25
A design and qualification of LED flip Chip-on-Board module with tunable color temperatures 期刊论文
MICROELECTRONICS RELIABILITY, 2018, 卷号: 84, 页码: 140-148
作者:  Fan, Jiajie;  Cao, Jianwu;  Yu, Chaohua;  Qian, Cheng;  Fan, Xuejun
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/30
A design and qualification of LED flip Chip-on-Board module with tunable color temperatures 会议论文
MICROELECTRONICS RELIABILITY, 2018-05-01
作者:  Fan, Jiajie;  Cao, Jianwu;  Yu, Chaohua;  Qian, Cheng;  Fan, Xuejun
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30
Wafer level optical proximity sensors and systems including wafer level optical proximity sensors 专利
专利号: US9570648, 申请日期: 2017-02-14, 公开日期: 2017-02-14
作者:  THARUMALINGAM, SRI GANESH A.;  WONG, SECK JIONG
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/24
Laser cutting sandwich structure glass-silicon-glass wafer with laser induced thermal-crack propagation 期刊论文
Optics and Laser Technology, 2017, 卷号: 93
作者:  Cai, Y. C.;  M. L. Wang;  H. Z. Zhang;  L. J. Yang;  X. H. Fu and Y. Wang
收藏  |  浏览/下载：15/0  |  提交时间：2018/06/08
Wafer-Level Hermetic Package by Low-Temperature Cu/Sn TLP Bonding with Optimized Sn Thickness 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 页码: 6111-6118
作者:  Wu, Zijian;  Cai, Jian;  Wang, Qian;  Wang, Junqiang;  Wang, Dejun
收藏  |  浏览/下载：12/0  |  提交时间：2019/12/09
Liquid Epoxy Molding Compound with High Glass Transition Temperature and High Thermal Conductivity 会议论文
18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA
作者:  Li, Jinze;  Zhang, Baotan;  Zhu, Pengli;  Li, Gang;  Sun, Rong
收藏  |  浏览/下载：6/0  |  提交时间：2020/01/03

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