QQ客服 官方微博 反馈留言

	Wafer-level optoelectronic packaging
	LAM, YEE, LOY
	2019-05-09
著作权人	DENSELIGHT SEMICONDUCTORS PTE. LTD.
专利号	WO2019086953A1
国家	世界知识产权组织
文献子类	发明申请
其他题名	Wafer-level optoelectronic packaging
英文摘要	A wafer-level optoelectronic packaging method includes fabricating a pre-singulated wafer. The pre-singulated wafer has a plurality of sub-mounts. A first sub-mount of the plurality of sub- mounts includes an optical waveguide formed on a substrate, a multi-layered sub-mount boundary wall that is formed on the optical waveguide, and a v-groove that is external to the sub- mount boundary wall. A plurality of optical dies are attached to the corresponding plurality of sub-mounts, such that each optical die is aligned to the optical waveguide of the corresponding sub-mount. A cap-wafer including a plurality of caps is attached to the pre-singulated wafer to obtain an encapsulated pre-singulated wafer. The encapsulated pre-singulated wafer is diced to obtain a plurality of optoelectronic packages. The optical waveguide of each optoelectronic package serves as an interconnection conduit between the corresponding optical die and an optical fiber placed in the corresponding v-groove.
公开日期	2019-05-09
申请日期	2018-10-16
状态	未确认
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54927]
专题	半导体激光器专利数据库
作者单位	DENSELIGHT SEMICONDUCTORS PTE. LTD.
推荐引用方式 GB/T 7714	LAM, YEE, LOY. Wafer-level optoelectronic packaging. WO2019086953A1. 2019-05-09.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。