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CORC

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Comparison and mechanism of electromigration reliability between Cu wire and Au wire bonding in molding state 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 卷号: 31, 期号: 4, 页码: 2967-2975
作者:  Du, Yahong;  Gao, Li-Yin;  Yu, Daquan;  Liu, Zhi-Quan
收藏  |  浏览/下载：19/0  |  提交时间：2021/02/03
Electromigration Effects During Resistance Brazing of Zn–Al/Al System 期刊论文
International Journal of Metalcasting, 2019, 卷号: 13, 期号: 4, 页码: 937-943
作者:  Yu, Wei-yuan;  Wu, Wei-jie;  Lin, Qiao-li;  X.-M., Sun
收藏  |  浏览/下载：19/0  |  提交时间：2020/11/14
Electromigration Effects During Resistance Brazing of Zn-Al/Al System 期刊论文
INTERNATIONAL JOURNAL OF METALCASTING, 2019, 卷号: 13, 期号: 4, 页码: 937-943
作者:  Yu, Wei-yuan;  Wu, Wei-jie;  Lin, Qiao-li;  Sun, Xue-min
收藏  |  浏览/下载：18/0  |  提交时间：2019/11/15
An observation and explanation of interior cracking at the interface of solder by electromigration 期刊论文
Microelectronics Reliability, 2019, 卷号: Vol.97, 页码: 79-84
作者:  Qizhi Wang;  Qingyi Liu;  Zheng Zhang;  Min Miao;  Yehao Su
收藏  |  浏览/下载：14/0  |  提交时间：2019/12/13
An observation and explanation of interior cracking at the interface of solder by electromigration 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: Vol.97, 页码: 79-84
作者:  Wang, QZ;  Liu, QY;  Zhang, Z;  Miao, M;  Su, YH
收藏  |  浏览/下载：12/0  |  提交时间：2019/12/17
An observation and explanation of interior cracking at the interface of solder by electromigration 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 97, 页码: 79-84
作者:  Wang, Qizhi;  Liu, Qingyi;  Zhang, Zheng;  Miao, Min;  Su, Yehao
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/30
Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 8, 页码: 1305-1314
作者:  Gao, LY;  Zhang, H;  Li, CF;  Guo, JD;  Liu, ZQ
收藏  |  浏览/下载：29/0  |  提交时间：2018/12/25
Effects of Current Stress for Low Temperature Cu/Sn/Cu Solid-State-Diffusion Bonding 会议论文
2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017-01-01
作者:  Cai, Jian;  Wang, Qian;  Wang, Dejun;  Wang, Junqiang;  Wu, Zijian
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/09
Influence of Stress on the Electromigration Life of Solder 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017, 卷号: 7, 页码: 762-767
作者:  Zhang, Zheng;  Liu, Qingyi;  Pan, Xiaoxu;  Wang, Qizhi;  Su, Fei
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30
Alleviating Through-Silicon-Via Electromigration for 3-D Integrated Circuits Taking Advantage of Self-Healing Effect 期刊论文
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2016, 卷号: 24, 页码: 3296-3308
作者:  Cheng, Yuanqing;  Todri-Sanial, Aida;  Yang, Jianlei;  Zhao, Weisheng
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/30

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