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	Wafer level optical proximity sensors and systems including wafer level optical proximity sensors
	THARUMALINGAM, SRI GANESH A.; WONG, SECK JIONG
	2017-02-14
著作权人	INTERSIL AMERICAS LLC
专利号	US9570648
国家	美国
文献子类	授权发明
其他题名	Wafer level optical proximity sensors and systems including wafer level optical proximity sensors
英文摘要	Optoelectronic devices (e.g., optical proximity sensors), methods for fabricating optoelectronic devices, and systems including optoelectronic devices, are described herein. An optoelectronic device includes a light detector die that includes a light detector sensor area. A light source die is attached to a portion of the light detector die that does not include the light detector sensor area. An opaque barrier is formed between the light detector sensor area and the light source die, and a light transmissive material encapsulates the light detector sensor area and the light source die. Rather than requiring a separate base substrate (e.g., a PCB substrate) to which are connected a light source die and a light detector die, the light source die is connected to the light detector die, such that the light detector die acts as the base for the finished optoelectronic device. This provides for cost reductions and reduces the total package footprint.
公开日期	2017-02-14
申请日期	2013-02-07
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37643]
专题	半导体激光器专利数据库
作者单位	INTERSIL AMERICAS LLC
推荐引用方式 GB/T 7714	THARUMALINGAM, SRI GANESH A.,WONG, SECK JIONG. Wafer level optical proximity sensors and systems including wafer level optical proximity sensors. US9570648. 2017-02-14.

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