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Improving thermal conductivity of polyvinylidene fluoride/low-melting-point alloy with segregated structure induced by incorporation of silver interface layer
期刊论文
JOURNAL OF POLYMER RESEARCH, 2022, 卷号: 29
作者:
Zhang, Ping
;
Zhang, Xian
;
Ding, Xin
;
Wang, Yanyan
;
Xiao, Chao
收藏
  |  
浏览/下载:20/0
  |  
提交时间:2022/12/23
Segregated structure
Intermetallic compound
Thermal conductivity
Sliver interface layer
Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP
期刊论文
Microelectronics Reliability, 2022, 卷号: 135
作者:
Yu, Weiyuan
;
Li, Binbin
;
Wu, Baolei
;
Wang, Fengfeng
;
Wang, Mingkang
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  |  
浏览/下载:18/0
  |  
提交时间:2022/08/09
Binary alloys
Copper
Copper alloys
Indium alloys
Lead-free solders
Microstructure
Shear flow
Silicon carbide
Soldering
Temperature
Thermoelectric equipment
Wide band gap semiconductors
Composite solders
Electronics devices
In-45cu composite solder paste
Intermetallics compounds
Microstructures and mechanical properties
Service temperature
Shears strength
Solderpaste
Ultrasonic action time
Ultrasonic-assisted TLP
Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint
期刊论文
MATERIALS, 2022, 卷号: 15, 期号: 14, 页码: 20
作者:
Zhang, Sinan
;
Wang Z(王臻)
;
Wang, Jie
;
Duan GH(段桂花)
;
Li, Haixia
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  |  
浏览/下载:21/0
  |  
提交时间:2022/08/22
Cu/SAC305/Cu solder joints
in situ tensile test
fracture analysis
X-ray mu-CT
FE simulation
Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint
期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11
作者:
Chen, Yinbo
;
Gao, Zhaoqing
;
Liu, Zhi-Quan
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  |  
浏览/下载:11/0
  |  
提交时间:2022/07/01
Sn-Bi-Ag solder
Grain orientation
Temperature gradient
Aging
Ag3Sn
Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 11
作者:
Chen, Yinbo
;
Wang, Changchang
;
Gao, Yue
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  |  
浏览/下载:16/0
  |  
提交时间:2022/01/27
Effect of Electric Field on the Microstructure and Properties of Brazed Joints of Float Glass and Kovar 4J29
期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2021, 卷号: 50, 期号: 11, 页码: 4003-4009
作者:
Yu Weiyuan
;
Yang Guoqing
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  |  
浏览/下载:9/0
  |  
提交时间:2022/03/01
ALTSAB
anodic bonding
soldering
float glass
Kovar
BV-Net: Bin-based Vector-predicted Network for tubular solder joint detection
期刊论文
MEASUREMENT, 2021, 卷号: 183, 页码: 8
作者:
Zhou, Chenlin
;
Shen, Xiaofei
;
Wang, Peng
;
Wei, Wei
;
Sun, Jia
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  |  
浏览/下载:69/0
  |  
提交时间:2021/11/04
Object detection
Defect detection
Quality inspection
Tubular solder joint detection
Deep learning
Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints
期刊论文
MATERIALS CHARACTERIZATION, 2021, 卷号: 178, 页码: 8
作者:
Gao, Li-Yin
;
Luo, Yi-Xiu
;
Wan, Peng
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:266/0
  |  
提交时间:2021/10/15
Solder joint
Intermetallic compound
Mechanical property
Nano-indentation
First principle calculation
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid-liquid electromigration
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:
Qiu, Hongyu
;
Xu, Han
;
Zhang, Chuge
;
Hu, Xiaowu
;
Jiang, Xiongxin
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2021/10/14
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration
期刊论文
Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:
Qiu, Hongyu
;
Xu, Han
;
Zhang, Chuge
;
Hu, Xiaowu
;
Jiang, Xiongxin
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2022/02/17
Binary alloys
Copper alloys
Electromigration
Tensile strength
Tin alloys
Bonding joints
Co content
Coaddition
Current direction
Electric density
Micro-structure evolutions
Solder joints
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