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Anodic bondable Li-Na-Al-B-Si-O glass-ceramics for Si - ULTCC heterogeneous integration 期刊论文
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2019, 卷号: 39, 期号: 7, 页码: 2419
作者:  Chen, Guanyu;  Ma, Mingsheng;  Liu, Zhifu;  Wei, Anqing;  Zavabeti, Ali
收藏  |  浏览/下载：81/0  |  提交时间：2019/12/26
Development of Auto Infrared Photoelastic Microscope for Stress Measurement of Silicon 会议论文
Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018
作者:  Li, T.;  Yao, R.;  Yu, C.;  Su, F.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/30
Investigation of Au/Si eutectic wafer bonding for MEMS accelerometers 期刊论文
2017, 卷号: 8
作者:  Li, Dongling[1,2,3];  Shang, Zhengguo[1,2,3];  She, Yin[1,2];  Wen, Zhiyu[1,2]
收藏  |  浏览/下载：4/0  |  提交时间：2019/11/29
Investigations of silicon wafer bonding utilizing sputtered Al and Sn films 期刊论文
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2017
Zhu, Zhiyuan; Yu, Min; Jin, Yufeng
收藏  |  浏览/下载：1/0  |  提交时间：2017/12/03
DEVICES  MEMS  
Anomalous electrical properties induced by hot-electron-injection in 130-nm partially depleted soi nmosfets fabricated on modified wafer 期刊论文
Ieee transactions on nuclear science, 2016, 卷号: 63, 期号: 5, 页码: 2731-2737
作者:  Dai, Lihua;  Bi, Dawei;  Ning, Bingxu;  Hu, Zhiyuan;  Song, Lei
收藏  |  浏览/下载：59/0  |  提交时间：2019/05/09
Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package 会议论文
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), Las Vegas, NV
作者:  Luo, Rongfeng;  Ren, Kuili;  Ma, Shenglin;  Yan, Jun;  Xia, Yanming
收藏  |  浏览/下载：42/0  |  提交时间：2017/01/15
Room-temperature wafer bonded InGaP/GaAs//InGaAsP/InGaAs four-junction solar cell grown by all-solid state molecular beam epitaxy 期刊论文
APPLIED PHYSICS EXPRESS, 2016, 卷号: 9, 期号: 1
作者:  Dai, P(代盼);  Lu, SL(陆书龙);  Uchida, SR;  Ji, L(季莲);  Wu, YY(吴渊渊)
收藏  |  浏览/下载：65/0  |  提交时间：2017/03/11
Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package 其他
2016-01-01
Luo, Rongfeng; Ren, Kuili; Ma, Shenglin; Yan, Jun; Xia, Yanming; Jin, Yufeng; Chen, Jing; Wu, Tianzhun; Yang, Hangao; Yuan, Lifang
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Controlled Assembly of Gold Nanostructures on a Solid Substrate via Imidazole Directed Hydrogen Bonding for High Performance Surface Enhance Raman Scattering Sensing of Hypochlorous Acid 期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2015, 卷号: 7, 期号: 30, 页码: 16730-16737
作者:  Sun, Jiefang;  Liu, Rui;  Tang, Jijun;  Zhang, Zongmian;  Zhou, Xiaoxia
收藏  |  浏览/下载：18/0  |  提交时间：2016/03/10
Discussion and analysis of Au/a-Si contact resistance in MEMS/NEMS devices 其他
2015-01-01
Fu, Fengshan; Yang, Fang; Wang, Wei; Huang, Xian; He, Jun; Zhang, Li; Guan, Taotao; Li, Rui; Zhang, Dacheng
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03

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