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CORC

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Compact optical transceiver by hybrid multichip integration 专利
专利号: US9921379, 申请日期: 2018-03-20, 公开日期: 2018-03-20
作者:  DING, LIANG;  NAGARAJAN, RADHAKRISHNAN L.;  COCCIOLI, ROBERTO
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/23
内嵌扰流式微通道TSV转接板关键工艺及其特性研究 学位论文
2016, 2016
夏雁鸣
收藏  |  浏览/下载：5/0  |  提交时间：2017/06/20
Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package 会议论文
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), Las Vegas, NV
作者:  Luo, Rongfeng;  Ren, Kuili;  Ma, Shenglin;  Yan, Jun;  Xia, Yanming
收藏  |  浏览/下载：42/0  |  提交时间：2017/01/15
Formation of Polymer Insulation Layer (Liner) on Through Silicon Vias (TSV) with High Aspect Ratio over 5:1 by Direct Spin Coating 会议论文
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), Las Vegas, NV
作者:  Li, Liyi;  Tuan, Chia-Chi;  Moon, Kyoung-Sik;  Zhang, Guoping;  Sun, Rong
收藏  |  浏览/下载：37/0  |  提交时间：2017/01/15
Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package 其他
2016-01-01
Luo, Rongfeng; Ren, Kuili; Ma, Shenglin; Yan, Jun; Xia, Yanming; Jin, Yufeng; Chen, Jing; Wu, Tianzhun; Yang, Hangao; Yuan, Lifang
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Design and Characterization of Petaloid Hollow Cu Interconnection for Interposer 其他
2016-01-01
Xia, Yanming; Ren, Kuili; Ma, Shenglin; Guan, Yong; Cai, Han; Luo, Rongfeng; Yan, Jun; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Process Development of Thick Si Interposer for 2.5D Integration of RF MEMS Devices 其他
2016-01-01
Ren, Kuili; Ma, Shenglin; Ma, Feilong; Yan, Jun; Xia, Yanming; Luo, Rongfeng; Jin, Yufeng; Chen, Jing
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Formation of Through Silicon Vias for Silicon Interposer in Wafer Level by Metal-Assisted Chemical Etching 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2015
作者:  Li, Liyi;  Zhang, Guoping;  Wong, Ching-Ping
收藏  |  浏览/下载：23/0  |  提交时间：2016/01/27
Design, Fabrication and Stress Evaluation of Si Electrical Interconnection Air-gapped from Si Interposer 会议论文
2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015-01-01
作者:  Ma, Shenglin;  Xia, Yanming;  Luo, Rongfeng;  Ren, Kuili;  Chen, Jing
收藏  |  浏览/下载：3/0  |  提交时间：2020/01/06
Electrical Simulation and Analysis of Si Interposer for 3D IC Integration 其他
2014-01-01
Sun, Xin; Miao, Min; Zhu, Yunhui; Fang, Runiu; Wang, Guanjiang; Lu, Wengao; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03

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