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浏览/检索结果: 共7条，第1-7条 帮助 限定条件 专题：上海大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Manufacturing Graphene-Encapsulated Copper Particles by Chemical Vapor Deposition in a Cold Wall Reactor 期刊论文 CHEMISTRYOPEN, 2019, 卷号: 8, 页码: 58-63 作者:  Chen, Shujing[1];  Zehri, Abdelhafid[2];  Wang, Qianlong[3];  Yuan, Guangjie[4];  Liu, Xiaohua[5] 收藏  |  浏览/下载：16/0  |  提交时间：2019/04/22 cold wall reactor  copper particles  graphene  oxidation resistance  thermal conductivity   The Semiconductor/Conductor Interface Piezoresistive Effect in an Organic Transistor for Highly Sensitive Pressure Sensors 期刊论文 ADVANCED MATERIALS, 2019, 卷号: 31, 页码: e1805630 作者:  Wang, Zhongwu[1];  Guo, Shujing[2];  Li, Hongwei[3];  Wang, Bin[4];  Sun, Yongtao[5] 收藏  |  浏览/下载：37/0  |  提交时间：2019/04/22 field-effect  piezoresistive effect  pressure sensors  transistors  tunable sensitivity   Highly Thermally Conductive and Light Weight Copper/Graphene Film Laminated composites for Cooling Applications 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Wang, Nan[1];  Chen, Shujing[2];  Nkansah, Amos[3];  Darmawan, Christian Chandra[4];  Ye, Lilei[5] 收藏  |  浏览/下载：13/0  |  提交时间：2019/04/22 Graphene film  Lamination  Light-weight  Thermal resistance   Tailoring the Thermal and Mechanical Properties of Graphene Film by Structural Engineering 期刊论文 SMALL, 2018, 卷号: 14, 页码: e1801346 作者:  Wang, Nan[1];  Samani, Majid Kabiri[2];  Li, Hu[3];  Dong, Lan[4];  Zhang, Zhongwei[5] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/22 grain size  graphene films  phonon transfer  thermal conductivity  turbostratic-stacking   An Overview of Carbon Nanotubes Based Interconnects for Microelectronic Packaging 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Chen, Shujing[1];  Shan, Bo[2];  Yang, Yiqun[3];  Yuan, Guangjie[4];  Huang, Shirong[5] 收藏  |  浏览/下载：17/0  |  提交时间：2019/04/24 Interconnect  CNTs based bumps  CNTs basednTSVs  resistivity  CNTs-Cu nanocomposite   Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Huang, Shirong[1];  Ke, Wei[2];  Yang, Yiqun[3];  Ye, Hui[4];  Chen, Shujing[5] 收藏  |  浏览/下载：41/0  |  提交时间：2019/04/24 Graphene protection barrier  Cu-Plated PCB  Reliability   Graphene-based Heat Spreading Materials for Electronics Packaging Applications 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Yuan, Guangjie[1];  Shan, Bo[2];  Chen, Shujing[3];  Yang, Yiqun[4];  Bao, Jie[5] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/24 heat spreading materials  graphene-based film  graphene-based electrically conductive adhesive  electronics packaging