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浏览/检索结果: 共12条，第1-10条 帮助 限定条件 发表日期：2020     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Shear strength and fracture surface analysis of lead-free solder joints with high fraction of IMCs 期刊论文 Vacuum, 2020, 卷号: 180 作者:  Qiu, Hongyu;  Hu, Xiaowu;  Li, Shuang;  Wan, Yongqiang;  Li, Qinglin 收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14 Binary alloys  Copper alloys  Elastic moduli  Fracture  Fracture mechanics  Shear flow  Soldered joints  Surface analysis  Tin alloys  Area ratios  Fracture mechanisms  Fracture surface analysis  Fracture surfaces  Fractured surfaces  Isothermal aging  Lead-free solder joint  Solder joints   The effect of finish layer on the interfacial cracking failure of Au-Si bonding 期刊论文 ENGINEERING FAILURE ANALYSIS, 2020, 卷号: 115, 页码: 8 作者:  Gao, Li-Yin;  Wen, Jian;  Li, Cai-Fu;  Chen, Chunhuan;  Liu, Zhi-Quan 收藏  |  浏览/下载：15/0  |  提交时间：2021/02/02 AuSi bonding  NiCo  Intermetallic compounds (IMCs)  Failure analysis  Crack   Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 17, 页码: 14714-14729 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin 收藏  |  浏览/下载：17/0  |  提交时间：2020/11/14 Bismuth compounds  Diffusion barriers  Gold  Gold compounds  Heat resistance  Microstructure  Nickel  Open circuit voltage  Soldering  Barrier films  Diffusion barrier films  Electrical resistances  Output current  Reflow--soldering  Solder joints  Temperature differences  Thermoelectric   Microstructure induced galvanic corrosion evolution of SAC305 solder alloys in simulated marine atmosphere 期刊论文 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 51, 页码: 40-53 作者:  Wang, Mingna;  Qiao, Chuang;  Jiang, Xiaolin;  Hao, Long;  Liu, Xiahe 收藏  |  浏览/下载：13/0  |  提交时间：2021/02/02 SAC305 solder  Marine atmosphere  Galvanic corrosion  In-situ EIS  Comb-like electrode   Microstructure induced galvanic corrosion evolution of SAC305 solder alloys in simulated marine atmosphere 期刊论文 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 51, 页码: 40-53 作者:  Wang, Mingna;  Qiao, Chuang;  Jiang, Xiaolin;  Hao, Long;  Liu, Xiahe 收藏  |  浏览/下载：19/0  |  提交时间：2021/02/02 SAC305 solder  Marine atmosphere  Galvanic corrosion  In-situ EIS  Comb-like electrode   Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the P-type Bi2Te3 solder joint 期刊论文 Journal of Alloys and Compounds, 2020, 卷号: 832 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin 收藏  |  浏览/下载：22/0  |  提交时间：2020/11/14 Bismuth compounds  Diffusion  Electric resistance  Electrodes  Growth rate  IV-VI semiconductors  Microstructure  Scanning electron microscopy  Tin  Tin compounds  Transmission electron microscopy  Diffusion process  Electrical resistances  Micro-structure evolutions  Porous structures  Thermodynamically stable  Thermoelectric  Volume diffusion  X ray diffractometers   The open-pin failure of power device under the combined effect of thermo-migration and electro-migration 期刊论文 Chinese Science Bulletin, 2020, 卷号: 65, 期号: 20, 页码: 2169-2177 作者:  Gao Liyin;  Li Caifu;  Cao Lihua;  Liu Zhiquan 收藏  |  浏览/下载：15/0  |  提交时间：2021/02/03 Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint 期刊论文 Soldering and Surface Mount Technology, 2020, 卷号: 32, 期号: 2, 页码: 73-81 作者:  Liu, Yun;  Yu, Weiyuan;  Sun, Xuemin;  Wang, Fengfeng 收藏  |  浏览/下载：9/0  |  提交时间：2022/02/17 Binary alloys  Dissolution  Electronics packaging  Energy dispersive spectroscopy  Intermetallics  Lead-free solders  Morphology  Needles  Scanning electron microscopy  Shear flow  Soldered joints  Soldering  Tin  Tin alloys  Tin metallography  Ultrasonic effects  Ultrasonic waves  Uranium metallography  Vanadium metallography  Design/methodology/approach  Dispersion strengthening  Energy dispersive X ray spectroscopy  Fractured surfaces  Grain morphologies  Grooves  Ultrasonic cavitation  Ultrasonic vibration   Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process 期刊论文 METALS AND MATERIALS INTERNATIONAL, 2020, 卷号: 26, 期号: 3, 页码: 333-345 作者:  Hua, Fu-an;  Song, Hong-wu;  Sun, Tao;  Li, Jian-ping 收藏  |  浏览/下载：14/0  |  提交时间：2021/02/02 Bimetal  Cold roll bonding  Intermetallic compound  Growth kinetics  Inter-diffusion   Fracture behavior and mechanical strength of sandwich structure solder joints with Cu–Ni(P) coating during thermal aging 期刊论文 Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 5, 页码: 3876-3889 作者:  Xu, Tao;  Hu, Xiaowu;  Li, Jiayin;  Li, Qinglin 收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14 Coatings  Fracture mechanics  Fracture testing  Sandwich structures  Thermal aging  Fractographic  Fracture behavior  Growth behavior  Mixed fractures  Pinning effects  Shear failure mode  Solder joints  Solid-state aging