Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process

doi:10.1007/s12540-019-00333-z

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	Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process
	Hua, Fu-an 2; Song, Hong-wu 1; Sun, Tao 2; Li, Jian-ping 2
刊名	METALS AND MATERIALS INTERNATIONAL
	2020-03-01
卷号	26 期号:3 页码:333-345
关键词	Bimetal Cold roll bonding Intermetallic compound Growth kinetics Inter-diffusion
ISSN号	1598-9623
DOI	10.1007/s12540-019-00333-z
通讯作者	Song, Hong-wu(hwsong@imr.ac.cn)
英文摘要	A model based on inter-diffusion theory was established to predict growth kinetics of the intermetallic compounds (IMCs) formed in roll bonded Al/Cu sheets during annealing process. The model can give good prediction of both IMC layers growth kinetics and element concentration distribution at the interface of roll bonded Cu/Al sheets with different thickness under different annealing conditions with certain roll reduction range. It is revealed that the calculated results of the proposed model are depended on the inter-diffusion coefficient of each components, which could be related to the interface bonding state, i.e., bonding methods or rolling reductions for roll bonding. And there was big difference in inter-diffusion coefficient of Al and Cu matrix under different bonding state, while the inter-diffusion coefficient of IMCs changed slightly. Graphic
WOS研究方向	Materials Science ; Metallurgy & Metallurgical Engineering
语种	英语
出版者	KOREAN INST METALS MATERIALS
WOS记录号	WOS:000517098900007
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/137364]
专题	金属研究所_中国科学院金属研究所
通讯作者	Song, Hong-wu
作者单位	1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China 2.Northeastern Univ, State Key Lab Rolling & Automat, Shenyang 110819, Peoples R China
推荐引用方式 GB/T 7714	Hua, Fu-an,Song, Hong-wu,Sun, Tao,et al. Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process[J]. METALS AND MATERIALS INTERNATIONAL,2020,26(3):333-345.
APA	Hua, Fu-an,Song, Hong-wu,Sun, Tao,&Li, Jian-ping.(2020).Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process.METALS AND MATERIALS INTERNATIONAL,26(3),333-345.
MLA	Hua, Fu-an,et al."Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process".METALS AND MATERIALS INTERNATIONAL 26.3(2020):333-345.