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浏览/检索结果: 共12条，第1-10条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Defect-Induced Pt?Co?Se Coordinated Sites with Highly Asymmetrical Electronic Distribution for Boosting Oxygen-Involving Electrocatalysis 期刊论文 Advanced Materials, 2019, 卷号: 31 作者:  Zhuang, Linzhou;  Jia, Yi;  Liu, Hongli;  Wang, Xin;  Hocking, Rosalie K. 收藏  |  浏览/下载：15/0  |  提交时间：2019/11/19 Electronic distribution  Intrinsic mechanisms  Mechanism studies  Metal species  Oxygen evolution  Oxygen evolution reaction  Synergetic interactions  Ultraviolet irradiations   Material removal mechanism and crack propagation in single scratch and double scratch tests of single-crystal silicon carbide by abrasives on wire saw 期刊论文 CERAMICS INTERNATIONAL, 2019, 卷号: 45, 期号: 1, 页码: 384-393 作者:  Wang, Peizhi;  Ge, Peiqi;  Ge, Mengran;  Bi, Wenbo;  Meng, Jianfeng 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/11 Scratch test  Crack propagation  Single-crystal silicon carbide  Wire  saw   Investigation on residual scratch depth and material removal rate of scratching machining single crystal silicon with Berkovich indenter 期刊论文 MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2019, 卷号: 100, 页码: 98-105 作者:  Ge, Mengran;  Zhu, Hongtao;  Ge, Peiqi;  Zhang, Cheng 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/11 Scratching machining  Residual scratch depth  Material removal rate  Elastic deformation   Investigation on critical crack-free cutting depth for single crystal silicon slicing with fixed abrasive wire saw based on the scratching machining experiments 期刊论文 MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2018, 卷号: 74, 页码: 261-266 作者:  Ge, Mengran;  Zhu, Hongtao;  Huang, Chuanzhen;  Liu, Ao;  Bi, Wenbo 收藏  |  浏览/下载：16/0  |  提交时间：2019/12/11 Scratching machining experiment  Material removal mode  Critical  crack-free cutting depth  Micro crack damage   The interaction of periodically distributed parallel cracks in anisotropic materials subjected to concentrated loads 期刊论文 ENGINEERING FRACTURE MECHANICS, 2018, 卷号: 199, 页码: 131-142 作者:  Wang, Peizhi;  Ge, Peiqi;  Bi, Wenbo;  Ge, Mengran;  Li, Long 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/11 Parallel cracks  Anisotropic materials  Concentrated loads  Stress  intensity factor   Fabrication and performance evaluation for resin-bonded diamond wire saw 期刊论文 INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2018, 卷号: 98, 期号: 9-12, 页码: 3269-3277 作者:  Ge, Mengran;  Bi, Wenbo;  Ge, Peiqi;  Gao, Yufei 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/11 Diamond wire saw  Resin binder  Optimization of components  Diamond wire  saw fabrication  Performance evaluation   Online dynamic cardiac imaging based on the elastic-net model 期刊论文 2017, 卷号: 25, 页码: 188-201 作者:  Hong, Mingjian[1];  Zhang, Haibiao[1];  Lin, Mengran[1];  Liu, Feng[2];  Ge, Yongxin[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/11/28 Effect of wire speed on subsurface cracks in wire sawing process of single crystal silicon carbide 期刊论文 ENGINEERING FRACTURE MECHANICS, 2017, 卷号: 184, 页码: 273-285 作者:  Wang, Peizhi;  Ge, Peiqi;  Bi, Wenbo;  Ge, Mengran;  Liu, Tengyun 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/12 Wire speed  Dynamic stress intensity factors  Single crystal silicon  carbide  Subsurface crack   A scratching force model of diamond abrasive particles in wire sawing of single crystal SiC 期刊论文 MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2017, 卷号: 68, 页码: 21-29 作者:  Wang, Peizhi;  Ge, Peiqi;  Li, Zongqiang;  Ge, Mengran;  Gao, Yufei 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/12 Nano scratching  Single crystal SiC  Wire sawing  Indentation size  effect   Experimental research on KDP crystal slicing with resin bonded diamond abrasive wire saw 期刊论文 INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2016, 卷号: 87, 期号: 5-8, 页码: 1671-1676 作者:  Ge, Mengran;  Bi, Wenbo;  Ge, Peiqi;  Bi, Yuchao 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/16 KDP crystals  Fixed abrasive wire saw  Crystal slicing  Orthogonal test  design