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	Effect of wire speed on subsurface cracks in wire sawing process of single crystal silicon carbide
	Wang, Peizhi; Ge, Peiqi; Bi, Wenbo; Ge, Mengran; Liu, Tengyun
刊名	ENGINEERING FRACTURE MECHANICS
	2017
卷号	184页码:273-285
关键词	Wire speed Dynamic stress intensity factors Single crystal silicon carbide Subsurface crack
DOI	10.1016/j.engfracmech.2017.09.002
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4594243
专题	山东大学
作者单位	1.Shandong Univ, Sch Mech Engn, Jinan 250061, Shandong, Peoples R China. 2.[Ge, Peiqi
推荐引用方式 GB/T 7714	Wang, Peizhi,Ge, Peiqi,Bi, Wenbo,et al. Effect of wire speed on subsurface cracks in wire sawing process of single crystal silicon carbide[J]. ENGINEERING FRACTURE MECHANICS,2017,184:273-285.
APA	Wang, Peizhi,Ge, Peiqi,Bi, Wenbo,Ge, Mengran,&Liu, Tengyun.(2017).Effect of wire speed on subsurface cracks in wire sawing process of single crystal silicon carbide.ENGINEERING FRACTURE MECHANICS,184,273-285.
MLA	Wang, Peizhi,et al."Effect of wire speed on subsurface cracks in wire sawing process of single crystal silicon carbide".ENGINEERING FRACTURE MECHANICS 184(2017):273-285.

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