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浏览/检索结果: 共8条，第1-8条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 A communication protocol design for an industry ethernet ring network (EI收录) 会议 Hangzhou, China, 作者:  Zhang, Yu-Hui[1];  Li, Di[2];  Chu, Qing-Xin[1];  Zhang, Yong-Bo[3];  Feng, Zhi-Hui[4] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/11 Artificial intelligence  Design  Embedded systems  Field programmable gate arrays (FPGA)  Medium access control  Network protocols   The Super Capacitor with Nano-SiC Film Electrode (CPCI-S收录) 会议 作者:  Zhang, Xiu-xia[1];  Li, Chao-hui[2];  Huang, Xin-hua[2];  Lou, Xiu-li[1];  Wen, Jun-xia[1] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/12 Nano-SiC Film  Electrode  Super capacitor  CCTO ceramics dielectric   Fabrication of a hybrid paste consisting of microscale Ag-plated Cu flakes and nanoscale Ag particles and characterization of low-temperature (CPCI-S收录) 会议 作者:  Jin, Hong;  Zhu, Jie-Fei;  Zhou, Min-Bo;  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/11 Ag-plated Cu flakes  plating process  hybrid paste  sintered joints   Electrical property of electrically conductive adhesives filled with micro-sized Ag flakes and modified by dicarboxylic acids (CPCI-S收录) 会议 作者:  Zhu, Jie-Fei;  Jin, Hong;  Zhou, Min-Bo;  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Electrically conductive adhesive  electrical conductivity  dicarboxylic acid  in-situ replacement  silver flake surfactant   Multi-center, randomized, controlled, open-label effectiveness study of primary tumor resection or not in asymptomatic colorectal cancer with (CPCI-S收录) 会议 作者:  Chen, Gong;  Zhang, Rong-xin;  Li, Yu-hong;  Lin, Jun-Zhong;  Kong, Ling-Heng 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 The interfacial thermo-mechanical reliability of 3D memory-chip stacking with through silicon via array (CPCI-S收录) 会议 作者:  Yuwen, Hui-Hui[1];  Qin, Hong-Bo[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 TSV  Cu-Cu interconnect  thermo-mechanical reliability  keep-away-zone  finite element method   Size and geometry effects on the electromigration behaviour of flip-chip Sn3.5Ag solder joints (CPCI-S收录) 会议 作者:  Qin, Hong-bo[1,2];  Yue, Wu[1,3];  Zhang, Xin-Ping[1];  Yang, Dao-guo[2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 electromigration  solder joint  size and geometry effects  current density  finite element analysis   Quasi in-situ study of morphological evolution of the interfacial IMC in single-sided interface Sn-0.3Ag-0.7Cu/Cu joints during multiple refl (CPCI-S收录) 会议 作者:  Zhou, Min-Bo[1];  Jin, Hong[1];  Ke, Chang-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/11 morphological evolution  intermetallic compounds  lead-free solder joint  multiple reflow  quasi in-situ method