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浏览/检索结果: 共8条，第1-8条 帮助 限定条件 专题：大连理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient (vol 172, pg 211, 2016) 期刊论文 MATERIALS LETTERS, 2018, 卷号: 230, 页码: 76-76 作者:  Kunwar, Anil;  Ma, Haoran;  Ma, Haitao;  Sun, Junhao;  Zhao, Ning 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02 Synchrotron radiation imaging study on the rapid IMC growth of Sn-xAg solders with Cu and Ni substrates during the heat preservation stage 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 页码: 589-601 作者:  Guo, Bingfeng;  Kunwar, Anil;  Jiang, Chengrong;  Zhao, Ning;  Sun, Junhao 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02 On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient 期刊论文 MATERIALS LETTERS, 2016, 卷号: 172, 页码: 211-215 作者:  Kunwar, Anil;  Ma, Haoran;  Ma, Haitao;  Sun, Junhao;  Zhao, Ning 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09 Thermomigration  Metals and alloys  Diffusion  Synchrotron radiation  Finite element method  Intermetallic alloys and compounds   Effect of cooling condition and Ag on the growth of intermetallic compounds in Sn-based solder joints 期刊论文 APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2016, 卷号: 122 作者:  Ma, Haoran;  Kunwar, Anil;  Guo, Bingfeng;  Sun, Junhao;  Jiang, Chengrong 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/09 Positive Feedback on Imposed Thermal Gradient by Interfacial Bubbles in Cu/liquid Sn-3.5Ag/Cu Joints 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16 作者:  Kunwar, Anil;  Ma, Haoran;  Qi, Meng;  Sun, Junhao;  Qu, Lin 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/09 Soldering  Synchrotron radiation  Intermetallic compounds  Thermal conductivity  Finite element analysis   In situ aging study on the variation of Sn0. 7Cu/Cu solid interface marked by bubbles 会议论文 16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA 作者:  Ma, Haoran;  Kunwar, Anil;  Sun, Junhao;  Zhao, Ning;  Huang, Mingliang 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/09 bubbles  in situ aging  solid interface  motion  intermetallic compounds  growth orientation  diffusion  SEM   Effects of Soldering Temperature and Cooling Rate on the as-Soldered Microstructures of Intermetallic Compounds in Sn-0.7Cu/Cu Joint 会议论文 16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, 2015-08-11 作者:  Guo, Bingfeng;  Kunwar, Anil;  Ma, Haoran;  Liu, Jiahui;  Li, Shuang 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/09 IMC  morphology  cooling  temperature  synchrotron radiation   The growth behavior of IMC on the Sn/Cu interface during solidification of multiple reflows 会议论文 15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12 作者:  Li, Shuang;  Du, Yao;  Qu, Lin;  Kunwar, Anil;  Sun, Junhao 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09 intermetallic compounds (IMC)  morphology  growth behavior  Cu6Sn5  solidification  multiple reflows