| In situ aging study on the variation of Sn0. 7Cu/Cu solid interface marked by bubbles | |
| Ma, Haoran; Kunwar, Anil; Sun, Junhao; Zhao, Ning; Huang, Mingliang; Ma, Haitao | |
| 2015 | |
| 会议名称 | 16 int conf elect packaging technology |
| 会议地点 | Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA |
| 关键词 | bubbles in situ aging solid interface motion intermetallic compounds growth orientation diffusion SEM |
| 会议录 | 16 int conf elect packaging technology
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| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4408415 |
| 专题 | 大连理工大学 |
| 作者单位 | Dalian Univ Technol, Sch Mat Sci & Engn, Dalian, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Ma, Haoran,Kunwar, Anil,Sun, Junhao,et al. In situ aging study on the variation of Sn0. 7Cu/Cu solid interface marked by bubbles[C]. 见:16 int conf elect packaging technology. Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA. |
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