| The growth behavior of IMC on the Sn/Cu interface during solidification of multiple reflows | |
| Li, Shuang; Du, Yao; Qu, Lin; Kunwar, Anil; Sun, Junhao; Liu, Jiahui; Zhao, Ning; Huang, Mingliang; Ma, Haitao | |
| 2014 | |
| 会议名称 | 15th International Conference on Electronic Packaging Technology (ICEPT) |
| 会议日期 | 2014-08-12 |
| 会议地点 | Chinese Inst Elect, Chengdu, PEOPLES R CHINA |
| 关键词 | intermetallic compounds (IMC) morphology growth behavior Cu6Sn5 solidification multiple reflows |
| 页码 | 937-939 |
| 会议录 | 15th International Conference on Electronic Packaging Technology (ICEPT)
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| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4428323 |
| 专题 | 大连理工大学 |
| 作者单位 | Dalian Univ Technol, Sch Mat Sci & Engn, Dalian, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Li, Shuang,Du, Yao,Qu, Lin,et al. The growth behavior of IMC on the Sn/Cu interface during solidification of multiple reflows[C]. 见:15th International Conference on Electronic Packaging Technology (ICEPT). Chinese Inst Elect, Chengdu, PEOPLES R CHINA. 2014-08-12. |
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