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CORC

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Faceted Kurdjumov-Sachs interface-induced slip continuity in the eutectic high-entropy alloy, AlCoCrFeNi2.1 会议论文
作者:  Xiong, Ting;  Yang, Wenfan;  Zheng, Shijian;  Liu, Zhaorui;  Lu, Yiping
收藏  |  浏览/下载：24/0  |  提交时间：2020/12/18
Interfacial microstructure evolution of gold alloy/Sn-based solder under different thermal aging conditions 会议论文
2ND INTERNATIONAL WORKSHOP ON MATERIALS SCIENCE AND MECHANICAL ENGINEERING (IWMSME2018), 2019-01-01
作者:  Mu, G. Q.;  Qu, W. Q.;  Wu, Y. C.;  Zhuang, H. S.
收藏  |  浏览/下载：64/0  |  提交时间：2019/12/30
An Introduction to Biomimetic Underwater Adhesion System 会议论文
Changsa, China, July 4-8, 2018
作者:  Liu LQ(刘连庆);  Tan WJ(谭文君);  Zhang C(张闯)
收藏  |  浏览/下载：23/0  |  提交时间：2019/03/30
Microstructure and Mechanical Properties of C/C Composite/TC17 Joints with Ag-Cu-Ti Brazing Alloy 会议论文
5TH ANNUAL INTERNATIONAL CONFERENCE ON MATERIAL SCIENCE AND ENGINEERING (ICMSE2017), 2018-01-01
作者:  Cao, Xiujie;  Zhu, Ying;  Guo, Wei;  Peng, Peng;  Ma, Kaituo
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/30
An Introduction to Biomimetic Underwater Adhesion System 会议论文
Changsa, China, July 4-8, 2018
作者:  Tan WJ(谭文君);  Zhang C(张闯);  Liu LQ(刘连庆)
收藏  |  浏览/下载：9/0  |  提交时间：2019/03/30
Multiphase Numerical Simulations of Binary Alloy Lamellar Eutectoid Growth 会议论文
作者:  Feng, Li;  Lu, Nini;  Gao, Yalong;  An, Guosheng;  Zhong, Junhe
收藏  |  浏览/下载：6/0  |  提交时间：2019/11/15
THE EFFECT OF INTERFACIAL MICROSTRUCTURES ON JOINING STRENGTH OF POLYMER-METAL HYBRID INTERFACE 会议论文
ASME International Mechanical Engineering Congress and Exposition (IMECE2016), Phoenix, AZ, 2017-01-01
作者:  Shen, Le;  Sun, Lingyu;  Li, Lijun;  Huang, Bincheng;  Ye, Xiao
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/30
Microstructure and interfacial reactions of Sn-Au-Ag solder joints on Cu and Ni substrates 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Chen, Y.;  Huang, M. L.;  Zhao, N.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
Microstructure and interfacial reactions on Sn-Au-Ag solder joints on Cu and Ni substrates 会议论文
17th International Conference on Electronic Packaging Technology Wuhan
作者:  Huang ML(黄明亮);  Zhao N(赵宁)
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09
Effects of Activation Treatment on Interfacial Bonding in A356-10 wt% B4C Composite Sheets Prepared by Rheo-Rolling 会议论文
作者:  Zhao, Zhan Yong;  Zhang, Yang;  Zhao, Zhou Yang;  Guan, Ren Guo;  Li, Yuan Dong
收藏  |  浏览/下载：21/0  |  提交时间：2019/11/15

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