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	Microstructure and interfacial reactions of Sn-Au-Ag solder joints on Cu and Ni substrates
	Chen, Y.; Huang, M. L.; Zhao, N.
	2016
会议名称	17th International Conference on Electronic Packaging Technology (ICEPT)
会议日期	2016-08-16
会议地点	Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA
关键词	Au-Sn solder Microstructure Wettability Interface reaction
页码	534-537
会议录	17th International Conference on Electronic Packaging Technology (ICEPT)
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/4372648
专题	大连理工大学
作者单位	Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian, Peoples R China.
推荐引用方式 GB/T 7714	Chen, Y.,Huang, M. L.,Zhao, N.. Microstructure and interfacial reactions of Sn-Au-Ag solder joints on Cu and Ni substrates[C]. 见:17th International Conference on Electronic Packaging Technology (ICEPT). Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA. 2016-08-16.

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