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CORC

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Novel insights in growth of intermetallic compounds between Sn–3.0Ag–0.5Cu solder and flexible PCB substrates under strain 期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 10, 页码: 9410-9420
作者:  Zhang, Xudong;  Hu, Xiaowu
收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14
Precise Cr-marker investigation on the reactive interface in the eutectic SnIn solder joint 期刊论文
Materials Letters, 2014, 卷号: 121, 页码: 185-187
F. F. Tian; P. J. Shang; Z. Q. Liu
收藏  |  浏览/下载：18/0  |  提交时间：2014/07/03
Microstructural Study on Kirkendall Void Formation in Sn-Containing/Cu Solder Joints During Solid-State Aging 期刊论文
Microscopy and Microanalysis, 2013, 卷号: 19, 页码: 105-108
Z. Q. Liu; P. J. Shang; F. F. Tan; D. X. Li
收藏  |  浏览/下载：14/0  |  提交时间：2014/04/18
Si-Cu Thin Film Electrode with Kirkendall Voids Structure for Lithium-Ion Batteries 期刊论文
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2012, 卷号: 159, 期号: 12, 页码: A2076
He, Y; Wang, YH; Yu, XQ; Li, H; Huang, XJ
收藏  |  浏览/下载：25/0  |  提交时间：2013/09/24
Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging 期刊论文
Philosophical Magazine Letters, 2011, 卷号: 91, 期号: 6, 页码: 410-417
P. J. Shang; Z. Q. Liu; D. X. Li; J. K. Shang
收藏  |  浏览/下载：18/0  |  提交时间：2012/04/13
Tensile fracture behavior of Sn-3.0Ag-0.5Cu solder joints on copper 会议论文
HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration, 2007-06-26
作者:  Ju, Guo-kui[1];  Wei, Xi-cheng[2];  Peng, Sun[3];  Liu, Johan[4]
收藏  |  浏览/下载：7/0  |  提交时间：2019/05/10
Phase field crystal simulation of morphological evolution and growth kinetics of Kirkendall voids at the interface and in the intermetallic c (CPCI-S收录) 会议
作者:  Ma, Wen-Jing[1];  Ke, Chang-Bo[1];  Liang, Shui-bao[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1]
收藏  |  浏览/下载：16/0  |  提交时间：2019/04/11

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