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	An observation and explanation of interior cracking at the interface of solder by electromigration
	Qizhi Wang; Qingyi Liu; Zheng Zhang; Min Miao; Yehao Su; Fei Su
刊名	Microelectronics Reliability
	2019
卷号	Vol.97页码:79-84
关键词	Electromigration (EM) Interfacial crack Solder Reliability
ISSN号	0026-2714
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4609284
专题	湖南大学
作者单位	1.c College of Electrical and Information Engineering, Hunan University, Changsha, China a School of Aeronautical Science and Engineering, Beihang University, Beijing, China 2.Beijing Information Science & Technology University, Beijing, China
推荐引用方式 GB/T 7714	Qizhi Wang,Qingyi Liu,Zheng Zhang,et al. An observation and explanation of interior cracking at the interface of solder by electromigration[J]. Microelectronics Reliability,2019,Vol.97:79-84.
APA	Qizhi Wang,Qingyi Liu,Zheng Zhang,Min Miao,Yehao Su,&Fei Su.(2019).An observation and explanation of interior cracking at the interface of solder by electromigration.Microelectronics Reliability,Vol.97,79-84.
MLA	Qizhi Wang,et al."An observation and explanation of interior cracking at the interface of solder by electromigration".Microelectronics Reliability Vol.97(2019):79-84.

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