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浏览/检索结果: 共18条，第1-10条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Recent situation of various environment conscious electronic packaging technology and materials 期刊论文 2010, 2010 Yang Jun; Zhang Yingyi; Fu Yuepeng; Tian Minbo 收藏  |  浏览/下载：2/0 Recent progress of ACF in flat panel display packaging applications 期刊论文 2010, 2010 Zhang Yingyi; Fu Yuepeng; Tan Kai; Tian Minbo 收藏  |  浏览/下载：7/0 Combination approach of FEM and circuit system in IR drop analysis and its applications 期刊论文 2010, 2010 Tang Zhanghong; Yuan Jiansheng 收藏  |  浏览/下载：6/0 Recent development of electronic packaging technology 期刊论文 2010, 2010 Fu Yuepeng; Tan Kai; Tian Minbo 收藏  |  浏览/下载：4/0 Development of reworkable underfill materials for flip chip 期刊论文 2010, 2010 Yu Kun; Liang Tongxiang; Guo Wenli 收藏  |  浏览/下载：5/0 Effects of cooler materials on cooling performance of ATCA mainboards 期刊论文 2010, 2010 Zhizhong Dong; Meng Meng; Zhanpeng Liang; Xiaofeng Peng 收藏  |  浏览/下载：2/0 Heat transfer of heat sink encapsulated with phase change material to prevent temperature from rising for electronic devices 期刊论文 2010, 2010 Lu Tao; Jiang Pei-xue 收藏  |  浏览/下载：3/0 Optimization of heat sink encapsulated with phase change material for high temperature ambient 期刊论文 2010, 2010 Lu Tao; Jiang Pei-xue; Deng Jian-qiang 收藏  |  浏览/下载：1/0 Preparation and sintering behavior of Au conductor pastes for LTCC substrate 期刊论文 2010, 2010 Yan Wang; Yang Liu; Jusheng Ma; Zhaowen Dong; Mingli Yin 收藏  |  浏览/下载：3/0 Packaging and frequency stability of monolithic scanning QCM sensor array in liquid 期刊论文 2010, 2010 Shi Zhi-song; Zhu Hui-zhong; Liang Wu-di 收藏  |  浏览/下载：3/0