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	Recent progress of ACF in flat panel display packaging applications
	Zhang Yingyi ; Fu Yuepeng ; Tan Kai ; Tian Minbo
	2010-10-12 ; 2010-10-12
关键词	Practical/ electronics packaging flat panel displays thin films/ flat panel display packaging application anisotropic conductive films tape carrier package chip on flex chip on glass/ B7260 Display technology B0170J Product packaging
中文摘要	With the development trends toward to large-scale, low-profile, high-resolution of flat panel display, it needs high requirement for flat panel display packaging technology. Anisotropic conductive films (ACF) are realized to meet the requirement of fine pitch capability and are widely used in FPDs (flat panel displays) packaging technologies so far. Various packaging technologies such as TCP (tape carrier package) , COF (chip on flex) and COG (chip on glass) using ACFs are summarized. Different requirements for ACFs used in the packaging technologies are analyzed, and the recent advances in structure and performance improvement of ACFs are pointed out, such as the size, hardness, content ratio of conductive particles and the type of resin used in ACF.
语种	中文
出版者	Editorial Board of Semiconductor Technology ; China
内容类型	期刊论文
源URL	[http://hdl.handle.net/123456789/78350]
专题	清华大学
推荐引用方式 GB/T 7714	Zhang Yingyi,Fu Yuepeng,Tan Kai,et al. Recent progress of ACF in flat panel display packaging applications[J],2010, 2010.
APA	Zhang Yingyi,Fu Yuepeng,Tan Kai,&Tian Minbo.(2010).Recent progress of ACF in flat panel display packaging applications..
MLA	Zhang Yingyi,et al."Recent progress of ACF in flat panel display packaging applications".(2010).

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